Abstract: A display system and a method for forming an output buffer of a source driver are provided. The display system includes a plurality of pixels coupled to a plurality of gate lines and a plurality of source lines. A gate driver provides a plurality of gate signals to the plurality of gate lines. A source driver provides a plurality of image signals to the plurality of source lines. The source driver includes an output buffer. The output buffer includes a transistor. The transistor is either a native transistor device, a depletion-mode transistor device or a low-threshold transistor device.

Abstract: A display system and a method for forming an output buffer of a source driver are provided. The display system includes a plurality of pixels coupled to a plurality of gate lines and a plurality of source lines. A gate driver provides a plurality of gate signals to the plurality of gate lines. A source driver provides a plurality of image signals to the plurality of source lines. The source driver includes an output buffer. The output buffer includes a transistor. The transistor is either a native transistor device, a depletion-mode transistor device or a low-threshold transistor device.

Abstract: A high-voltage semiconductor device is provided. The device includes a semiconductor substrate having a first conductivity type, and a first doping region having a second conductivity type therein. An epitaxial layer is on the semiconductor substrate. A body region having the first conductivity type is in the epitaxial layer on the first doping region. A second doping region and a third doping region that have the second conductivity type are respectively in the epitaxial layer on both opposite sides of the body region, so as to adjoin the body region. Source and drain regions are respectively in the body region and the second doping region. A field insulating layer is in the second doping region between the source and drain regions. A gate structure is on the epitaxial layer to cover a portion of the field insulating layer.

Abstract: A display system and a method for forming an output buffer of a source driver are provided. The display system includes a plurality of pixels coupled to a plurality of gate lines and a plurality of source lines. A gate driver provides a plurality of gate signals to the plurality of gate lines. A source driver provides a plurality of image signals to the plurality of source lines. The source driver includes an output buffer. The output buffer includes a transistor. The transistor is either a native transistor device, a depletion-mode transistor device or a low-threshold transistor device.

Abstract: A switch-mode converter includes a high-side driver, a high-side transistor, a low-side driver, a low-side transistor, a capacitor, and an active diode. The high-side driver is supplied by the bootstrap voltage of the bootstrap node and a floating reference voltage of a floating reference node, and generates the high-side output signal. The high-side transistor provides an input voltage to the floating reference node according to the high-side output signal. The low-side driver generates the low-side output signal. The low-side transistor couples the floating reference node to a ground according to the low-side output signal. The capacitor is coupled between the bootstrap node and the floating reference node. The active diode provides the supply voltage to the bootstrap node. When the bootstrap voltage exceeds the supply voltage, the active diode isolates the supply voltage from the bootstrap node.

Abstract: A high-voltage semiconductor device is provided. The device includes a semiconductor substrate having a first conductivity type, and a first doping region having a second conductivity type therein. An epitaxial layer is on the semiconductor substrate. A body region having the first conductivity type is in the epitaxial layer on the first doping region. A second doping region and a third doping region that have the second conductivity type are respectively in the epitaxial layer on both opposite sides of the body region, so as to adjoin the body region. Source and drain regions are respectively in the body region and the second doping region. A field insulating layer is in the second doping region between the source and drain regions. A gate structure is on the epitaxial layer to cover a portion of the field insulating layer.

Abstract: A semiconductor substrate structure includes a seed layer on a substrate, a first gallium nitride layer on the seed layer, and a patterned first hard mask layer on the first gallium nitride layer, wherein the patterned first hard mask layer includes a first opening. The semiconductor substrate structure also includes a second gallium nitride layer in the first opening and on the patterned first hard mask layer, a patterned second hard mask layer on the second gallium nitride layer, wherein the patterned second hard mask layer includes a second opening, and at least a portion of a projection on the substrate of the first opening and a projection on the substrate of the second opening are non-overlapped. The semiconductor substrate structure further includes a third gallium nitride layer in the second opening and on the patterned second hard mask layer.

Abstract: A high-voltage semiconductor structure including a substrate, a first doped region, a well, a second doped region, a third doped region, a fourth doped region, and a gate structure is provided. The substrate has a first conductive type. The first doped region has the first conductive type and is formed in the substrate. The well has a second conductive type and is formed in the substrate. The second doped region has the second conductive type and is formed in the first doped region. The third doped region has the first conductive type and is formed in the well. The fourth doped region has the second conductive type and is formed in the well. The gate structure is disposed over the substrate and partially covers the first doped region and the well.

Abstract: A high-voltage semiconductor structure including a substrate, a first doped region, a well, a second doped region, a third doped region, a fourth doped region, and a gate structure is provided. The substrate has a first conductive type. The first doped region has the first conductive type and is formed in the substrate. The well has a second conductive type and is formed in the substrate. The second doped region has the second conductive type and is formed in the first doped region. The third doped region has the first conductive type and is formed in the well. The fourth doped region has the second conductive type and is formed in the well. The gate structure is disposed over the substrate and partially covers the first doped region and the well.

Abstract: A switch-mode converter includes a high-side driver, a high-side transistor, a low-side driver, a low-side transistor, a capacitor, and an active diode. The high-side driver is supplied by the bootstrap voltage of the bootstrap node and a floating reference voltage of a floating reference node, and generates the high-side output signal. The high-side transistor provides an input voltage to the floating reference node according to the high-side output signal. The low-side driver generates the low-side output signal. The low-side transistor couples the floating reference node to a ground according to the low-side output signal. The capacitor is coupled between the bootstrap node and the floating reference node. The active diode provides the supply voltage to the bootstrap node. When the bootstrap voltage exceeds the supply voltage, the active diode isolates the supply voltage from the bootstrap node.

Abstract: A high-side circuit, adapted for a switched-mode converter, includes a level shifter, a high-side driver, a high-side transistor, a capacitor, and an active diode. The level shifter receives a first signal to generate a set signal. The high-side driver is supplied by a bootstrap voltage of a bootstrap node and a floating reference voltage of a floating reference node, which controls the high-side transistor to provide an input voltage to the floating reference node according to the set signal. The capacitor is coupled between the bootstrap node and the floating reference node. The active diode provides a supply voltage to the bootstrap node. When the bootstrap voltage exceeds the supply voltage, the active diode isolates the supply voltage from the bootstrap node according to a control voltage. The active diode includes a first-type well coupled to the bootstrap node, where the high-side driver is disposed.

Abstract: A high-side circuit, adapted for a switched-mode converter, includes a level shifter, a high-side driver, a high-side transistor, a capacitor, and an active diode. The level shifter receives a first signal to generate a set signal. The high-side driver is supplied by a bootstrap voltage of a bootstrap node and a floating reference voltage of a floating reference node, which controls the high-side transistor to provide an input voltage to the floating reference node according to the set signal. The capacitor is coupled between the bootstrap node and the floating reference node. The active diode provides a supply voltage to the bootstrap node. When the bootstrap voltage exceeds the supply voltage, the active diode isolates the supply voltage from the bootstrap node according to a control voltage. The active diode includes a first-type well coupled to the bootstrap node, where the high-side driver is disposed.

Abstract: A semiconductor device includes: a semiconductor substrate; a semiconductor layer disposed over the semiconductor layer; a first well region disposed in the semiconductor layer and the semiconductor substrate; a second well region disposed in the semiconductor layer; a first isolation element disposed in the first well region; a second isolation element disposed in the second well region; a gate structure disposed in the semiconductor layer between the first isolation element and the second isolation element; a first doped region disposed in the first well region; and a second doped region disposed in the second well region. The bottom surface of the gate structure is above, below or substantially level with a bottom surface of the first isolation structure.

Abstract: A semiconductor device includes: a semiconductor substrate; a semiconductor layer disposed over the semiconductor layer; a first well region disposed in the semiconductor layer and the semiconductor substrate; a second well region disposed in the semiconductor layer; a first isolation element disposed in the first well region; a second isolation element disposed in the second well region; a gate structure disposed in the semiconductor layer between the first isolation element and the second isolation element; a first doped region disposed in the first well region; and a second doped region disposed in the second well region. The bottom surface of the gate structure is above, below or substantially level with a bottom surface of the first isolation structure.

Abstract: The invention provides a method for fabricating a deep trench isolation including: providing a substrate; forming a first trench in the substrate; conformally forming a first liner layer on the sidewall and bottom of the first trench; forming a first filler layer on the first liner layer and filling the first trench; forming an epitaxial layer on the substrate and the first trench; forming a second trench through the epitaxial layer and over the first trench; conformally forming a second liner layer on the sidewall and bottom of the second trench; and forming a second filler layer on the second liner layer and filling the second trench.

Abstract: The invention provides a method for fabricating a deep trench isolation including: providing a substrate; forming a first trench in the substrate; conformally forming a first liner layer on the sidewall and bottom of the first trench; forming a first filler layer on the first liner layer and filling the first trench; forming an epitaxial layer on the substrate and the first trench; forming a second trench through the epitaxial layer and over the first trench; conformally forming a second liner layer on the sidewall and bottom of the second trench; and forming a second filler layer on the second liner layer and filling the second trench.

Abstract: The present invention discloses a method for fabricating a semiconductor device. A substrate is provided. At least one first and second gate structure, having sidewalls, are included on a surface of the substrate. A first ion implantation process is performed to form a shallow-junction doping region of a first conductive type in the substrate next to each of the sidewalls of the first gate structure, followed by the formation of offset spacers on each of the sidewalls of the first and second gate structure. A second ion implantation process is performed to form a shallow-junction doping region of a second conductive type in the substrate next to the offset spacer on each of the sidewalls of the second gate structure.

Abstract: The present invention discloses a method for fabricating a semiconductor device. A substrate is provided. At least one first and second gate structure, having sidewalls, are included on a surface of the substrate. A first ion implantation process is performed to form a shallow-junction doping region of a first conductive type in the substrate next to each of the sidewalls of the first gate structure, followed by the formation of offset spacers on each of the sidewalls of the first and second gate structure. A second ion implantation process is performed to form a shallow-junction doping region of a second conductive type in the substrate next to the offset spacer on each of the sidewalls of the second gate structure.