Abstract: A curable silicone resin composition according to the present invention includes at least the following components: (A) a silicone resin having a hydrogen atom bonded to silicon atom (as SiH group); (B) a silicone resin having a vinyl group bonded to silicon atom (as Si—CH?CH2 group); and (C) a platinum catalyst, wherein the total amount of silanol (Si—OH) group in the components (A) and (B) is 0.5 to 5.0 mmol/g; and wherein the amount of platinum in the component (C) relative to the total mass of the components (A), (B) and (C) is 0.003 to 3.0 ppm in mass units. A cured product obtained by heating the composition is suitably usable as an encapsulant of an optical semiconductor device.

Abstract: Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si—OH group and Si—H group, a silicone (B) of a specific structure and a composition containing Si—OH group and Si—CH?CH2 group, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si—OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si—OH groups, as compared with a hydrosilylation reaction which is a reaction of Si—CH?CH2 group and Si—H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.

Abstract: Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si—OH group and Si—H group, a silicone (B) of a specific structure and a composition containing Si—OH group and Si—CH?CH2 group, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si—OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si—OH groups, as compared with a hydrosilylation reaction which is a reaction of Si—CH?CH2 group and Si—H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.