Patents by Inventor Yu-Mei Cheng

Yu-Mei Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10391163
    Abstract: A vaccine composition is disclosed. The vaccine composition comprises: (a) a therapeutically effective amount of an influenza virus-like particle (VLP) comprising: (i) influenza M1, influenza M2, influenza hemagglutinin (HA), and influenza neuraminidase (NA) proteins; (b) Foot-and-mouth disease virus (FMDV) capsid protein VP3, recombinant FMDV VP3 (rVP3), VP3 peptide, or SUMO VP3; and (c) alum. Also disclosed is use of a vaccine composition according to the invention in the manufacture of a medicament for inducing an immunogenic response in a subject in need thereof.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 27, 2019
    Assignee: Academia Sinica
    Inventors: Shu-Mei Liang, Pei-Wen Hsiao, Ming-Chu Cheng, Yu-Chih Yang
  • Publication number: 20080159191
    Abstract: A wireless communication method for information display devices is provided.
    Type: Application
    Filed: June 20, 2007
    Publication date: July 3, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Hsiung Wang, Shi-Feng Hsu, C.H. Huang, Yu-Mei Cheng, Shing-Bih Chen
  • Patent number: 7064427
    Abstract: A unitary buried array capacitor and microelectronic structures incorporating such capacitors are disclosed. A unitary buried array capacitor can be formed by a top layer of electrode, a middle layer of dielectric, and a bottom layer of electrode. A first electrode lead, a second electrode lead and at least one interconnect line pass through the three layers while only the first electrode lead making electrical contact with the top layer of electrode and only the second electrode lead making electrical contact with the bottom electrode.
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: June 20, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Stephen Chung, Jungle Lee, Shinn-Juh Lay, Randy Wu, Huey-Ru Chang, Yu-Mei Cheng
  • Publication number: 20050269685
    Abstract: A unitary buried array capacitor and microelectronic structures incorporating such capacitors are disclosed. A unitary buried array capacitor can be formed by a top layer of electrode, a middle layer of dielectric, and a bottom layer of electrode. A first electrode lead, a second electrode lead and at least one interconnect line pass through the three layers while only the first electrode lead making electrical contact with the top layer of electrode and only the second electrode lead making electrical contact with the bottom electrode.
    Type: Application
    Filed: June 7, 2004
    Publication date: December 8, 2005
    Inventors: Stephen Chung, Jungle Lee, Shinn-Juh Lay, Randy Wu, Huey-Ru Chang, Yu-Mei Cheng
  • Patent number: D542303
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: May 8, 2007
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventor: Yu-Mei Cheng
  • Patent number: D553618
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: October 23, 2007
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventor: Yu-Mei Cheng
  • Patent number: D556196
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: November 27, 2007
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventor: Yu-Mei Cheng