Patents by Inventor Yu-Mei Liu

Yu-Mei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8906599
    Abstract: A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: December 9, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Mei Liu, Chin-Hsiang Lin, Heng-Hsin Liu, Heng-Jen Lee, I-Hsiung Huang, Chih-Wei Lin
  • Publication number: 20130309612
    Abstract: A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Mei LIU, Chin-Hsiang LIN, Heng-Hsin LIU, Heng-Jen LEE, I-Hsiung HUANG, Chih-Wei LIN
  • Patent number: D440968
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: April 24, 2001
    Assignee: Proview Electronics (Taiwan) Co., Ltd.
    Inventors: Yuan-Shie Chang, Yu-Mei Liu, Shu-Fen Ke
  • Patent number: D442587
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: May 22, 2001
    Assignee: Proview Electronics (Taiwan) Co., Ltd.
    Inventors: Yuan-Shie Chang, Yu-Mei Liu, Shu-Fen Ke
  • Patent number: D416877
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: November 23, 1999
    Assignee: Dual Technology Corporation
    Inventors: Yu-Mei Liu, Yuan-Shie Chang