Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A charging device includes a base, a charging assembly, a filler, and a drain assembly. The base includes a charging groove and a receiving groove. The charging groove has a first opening and a second opening. The first opening has a first through hole. The receiving groove has a second through hole. The charging assembly is connected to the second opening. The filler is connected to an inner side of the first opening and disposed close to the first through hole, and has a connecting opening. Two ends of the drain assembly are connected to the first through hole and the second through hole respectively. The inner side of the first opening has a first distance, an inner side of the connecting opening has a second distance, and the first distance is greater than the second distance.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A braking control method for a braking system of a vehicle is provided according to an exemplary embodiment of the disclosure. The braking control method comprises: obtaining a total braking distance and a first speed of the vehicle; obtaining braking delay information related to the braking system, wherein the braking delay information includes first time information and second time information, the first time information reflects a delay time of a braking signal, and the second time information reflects a preparation time for performing a braking operation according to the braking signal by the braking system; obtaining deceleration information according to the total braking distance, the first speed and the braking delay information; generating the braking signal according to the deceleration information; and performing the braking operation according to the braking signal.

Abstract: A braking control method for a braking system of a vehicle is provided according to an exemplary embodiment of the disclosure. The braking control method comprises: obtaining a total braking distance and a first speed of the vehicle; obtaining braking delay information related to the braking system, wherein the braking delay information includes first time information and second time information, the first time information reflects a delay time of a braking signal, and the second time information reflects a preparation time for performing a braking operation according to the braking signal by the braking system; obtaining deceleration information according to the total braking distance, the first speed and the braking delay information; generating the braking signal according to the deceleration information; and performing the braking operation according to the braking signal.

Abstract: A probe structure includes a sleeve, a needle shaft and an elastic member. The needle shaft is accommodated in the sleeve and includes a first groove for accommodating the elastic member. The probe structure further includes a conductive component installed at the bottom of the sleeve and having an end connected into the first groove, and a second groove, so that the elastic member is situated in the first and second grooves. When the needle shaft is pressed and moved, the inner wall of the second groove is contacted with an outer sidewall of the conductive component to define a second conductive channel. With the two conductive channels, the effects of maintaining stable current transmission efficiency, reducing poor contact or disconnection, and providing good structural stability are achieved.

Abstract: A probe structure includes a sleeve, a needle shaft and an elastic member. The needle shaft is accommodated in the sleeve and includes a first groove for accommodating the elastic member. The probe structure further includes a conductive component installed at the bottom of the sleeve and having an end connected into the first groove, and a second groove, so that the elastic member is situated in the first and second grooves. When the needle shaft is pressed and moved, the inner wall of the second groove is contacted with an outer sidewall of the conductive component to define a second conductive channel. With the two conductive channels, the effects of maintaining stable current transmission efficiency, reducing poor contact or disconnection, and providing good structural stability are achieved.

Abstract: A connector assembly includes a first connector and a second connector. The first connector is coupled to a first electronic device, and the second connector is coupled to a second electronic device and detachably mated with the first connector. The first connector includes a first housing and a magnetic member. The magnetic member is installed inside the first housing and for generating magnetic field. The second connector includes a second housing and a magnetic sensor disposed in the second housing. The magnetic sensor senses the magnetic field generated by the magnetic member when the second connector is mated with the first connector, so as to drive the second electronic device to power the first electronic device.

Abstract: A connector assembly includes a first connector and a second connector. The first connector is coupled to a first electronic device, and the second connector is coupled to a second electronic device and detachably mated with the first connector. The first connector includes a first housing and a magnetic member. The magnetic member is installed inside the first housing and for generating magnetic field. The second connector includes a second housing and a magnetic sensor disposed in the second housing. The magnetic sensor senses the magnetic field generated by the magnetic member when the second connector is mated with the first connector, so as to drive the second electronic device to power the first electronic device.

Abstract: A replaceable probe to be used on a test feature includes a hollow probe body to house an elastic element and at least one needle inserting in the probe body. The needle presses the elastic element and is retractable in the probe body. The probe body is surrounded by a hollow sleeve to form an anchoring relationship with the inner wall of the sleeve. The sleeve has an opening on one end to receive the needle and an open side on other end to allow the probe body to escape the sleeve. Thus when the needle is worn out after being used for a period of time, the probe body can be removed from the sleeve and test feature for replacement without disassembling the test feature. Replacement can be done quickly.

Abstract: The present invention discloses a probe clamp used for removing a damaged probe. The probe clamp includes a container, a seizing head and a push rod, and the seizing head is sheathed onto a desired removing probe. If a force is applied to drive the push rod to withdraw the seizing head, then the damaged probe can be clamped tightly for the removal. The probe clamp of the invention not only can seize the damaged probe quickly and precisely, but also can clamp and remove the probe effectively, so that the probe will not slide or touch other probes that may result in damaging more probes. Therefore, the invention improves the working efficiency and reduces the consumption of probes effectively.

Abstract: This invention uses the “row/column buffer switches” to make it possible that LCD display can scan either vertically or horizontally. This invention solved the limitation of the traditional LCD can only scan in one direction (horizontal) issue. That makes LCD will be able to accept either the landscape or the portrait images without a pre-rotate process. With the easy implementation, buffer switches can be applied to both of the two standards, STN (known as passive matrix addressing) and TFT (known as active matrix addressing) LCD devices.