Patents by Inventor Yu-Min FU

Yu-Min FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145597
    Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming source/drain regions over the fin on opposing sides of the gate structure; forming a first dielectric layer and a second dielectric layer successively over the source/drain regions; performing a first etching process to form an opening in the first dielectric layer and in the second dielectric layer, where the opening exposes an underlying electrically conductive feature; after performing the first etching process, performing a second etching process to enlarge a lower portion of the opening proximate to the substrate; and forming a contact plug in the opening after the second etching process.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 2, 2024
    Inventors: Yu-Lien Huang, Guan-Ren Wang, Ching-Feng Fu, Yun-Min Chang
  • Patent number: 11916147
    Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming source/drain regions over the fin on opposing sides of the gate structure; forming a first dielectric layer and a second dielectric layer successively over the source/drain regions; performing a first etching process to form an opening in the first dielectric layer and in the second dielectric layer, where the opening exposes an underlying electrically conductive feature; after performing the first etching process, performing a second etching process to enlarge a lower portion of the opening proximate to the substrate; and forming a contact plug in the opening after the second etching process.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Yu-Lien Huang, Guan-Ren Wang, Ching-Feng Fu, Yun-Min Chang
  • Patent number: 11665484
    Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: May 30, 2023
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
  • Publication number: 20220340409
    Abstract: Disclosed is a coil module, comprising: a vibrating membrane suspended on an air chamber defined and supported by a first substrate, at least one planar coil, embedded in the vibrating membrane, and at least a soft magnet, embedded in the vibrating membrane and disposed surrounding at least a portion of a contour of the planar coil; wherein a substantial portion of the planar coil locates at substantially the same plan where a portion of the soft magnet is arranged. A microspeaker and a. method for preparing the same are also disclosed.
    Type: Application
    Filed: January 19, 2022
    Publication date: October 27, 2022
    Inventors: Yu Min FU, Tung Yu WU
  • Publication number: 20220141595
    Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.
    Type: Application
    Filed: October 22, 2021
    Publication date: May 5, 2022
    Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 11051106
    Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 29, 2021
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
  • Publication number: 20200344551
    Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 29, 2020
    Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 10520469
    Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: December 31, 2019
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Jia-Chyi Pan, Zi-Li Kuo, Yu-Ting Cheng, Yu-Min Fu
  • Publication number: 20190257786
    Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.
    Type: Application
    Filed: May 1, 2019
    Publication date: August 22, 2019
    Inventors: Jia-Chyi PAN, Zi-Li KUO, Yu-Ting CHENG, Yu-Min FU
  • Patent number: 10345258
    Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: July 9, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Jia-Chyi Pan, Zi-Li Kuo, Yu-Ting Cheng, Yu-Min Fu
  • Patent number: 10159420
    Abstract: A nerve impulse signal stimulation device and a method for fabricating the same are provided. The nerve impulse signal stimulation device includes: a substrate having a first surface and a second surface opposite to the first surface; a first metal layer formed on the first surface of the substrate; a second metal layer formed on the first metal layer; a plurality of openings exposing a portion of the first surface of the substrate, a portion of the first metal layer and a portion of the second metal layer; and a ferromagnetic material attached to the second surface of the substrate. The openings cause the nerve impulse signal stimulation device to obtain a parallel circuit structure, thereby increasing the current load and the magnetic field intensity, reducing the size of the device, and ensuring the safety of operations.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: December 25, 2018
    Assignee: National Chiao Tung University
    Inventors: Yu-Ting Cheng, Chung-Yu Wu, Jui-Sheng Sun, Yu-Min Fu, Che-Yu Chen, Xin-Hong Qian
  • Publication number: 20170356875
    Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.
    Type: Application
    Filed: June 9, 2016
    Publication date: December 14, 2017
    Inventors: Jia-Chyi PAN, Zi-Li KUO, Yu-Ting CHENG, Yu-Min FU
  • Publication number: 20170245771
    Abstract: A nerve impulse signal stimulation device and a method for fabricating the same are provided. The nerve impulse signal stimulation device includes: a substrate having a first surface and a second surface opposite to the first surface; a first metal layer formed on the first surface of the substrate; a second metal layer formed on the first metal layer; a plurality of openings exposing a portion of the first surface of the substrate, a portion of the first metal layer and a portion of the second metal layer; and a ferromagnetic material attached to the second surface of the substrate. The openings cause the nerve impulse signal stimulation device to obtain a parallel circuit structure, thereby increasing the current load and the magnetic field intensity, reducing the size of the device, and ensuring the safety of operations.
    Type: Application
    Filed: July 22, 2016
    Publication date: August 31, 2017
    Inventors: Yu-Ting Cheng, Chung-Yu Wu, Jui-Sheng Sun, Yu-Min Fu, Che-Yu Chen, Xin-Hong Qian
  • Patent number: 9412692
    Abstract: A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: August 9, 2016
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Yu-Ting Cheng, Yu-Min Fu
  • Publication number: 20160204051
    Abstract: A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements.
    Type: Application
    Filed: January 13, 2015
    Publication date: July 14, 2016
    Inventors: Yu-Ting CHENG, Yu-Min FU