Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: An LED assembly, comprising: a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region; a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate; a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate; a plurality of LED elements arranged on the first wavelength conversion layer; a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer; a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and a plurality of electrical contacts electrically connect

Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.

Abstract: A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.

Abstract: A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.

Abstract: A method for fabricating a self assembling light emitting diode lens is disclosed. The method includes providing a first fluid with a first viscosity and a second fluid with a second viscosity. The refractive index of the first fluid is the same as the refractive index of the second fluid. Then the first fluid and the second fluid are blended in a predetermined ratio to obtain a third fluid with a third viscosity. Then the third fluid is dispended on a light emitting diode, which is disposed on a substrate. The third fluid is cured to form a lens on the light emitting diode. The shape of the lens is controlled by the third viscosity.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.