Patents by Inventor Yu-Ming Hsiang

Yu-Ming Hsiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985314
    Abstract: Video processing methods and apparatuses in a video encoding or decoding system for processing out-of-bounds nodes in a current picture. An out-of-bounds node is a coding tree node with a block region across a current picture boundary. The video processing method or apparatus determines an inferred splitting type, applies the inferred splitting type to split the out-of-bounds node into child blocks, adaptively splits each child block into one or multiple leaf blocks, and encodes or decodes the leaf blocks in the out-of-bounds node inside the current picture. The inferred splitting type for partitioning out-of-bounds nodes in an inter slice, picture, or tile is the same as the inferred splitting type for partitioning out-of-bounds nodes in an intra slice, picture, or tile.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Publication number: 20240145571
    Abstract: In some embodiments, the present disclosure relates to an integrated circuit (IC) in which a memory structure comprises an inhibition layer inserted between two ferroelectric layers to create a tetragonal-phase dominant ferroelectric structure. In some embodiments, the ferroelectric structure includes a first ferroelectric layer, a second ferroelectric layer overlying the first ferroelectric layer, and a first inhibition layer disposed between the first and second ferroelectric layers and bordering the second ferroelectric layer. The first inhibition layer is a different material than the first and second ferroelectric layers.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 2, 2024
    Inventors: Po-Ting Lin, Yu-Ming Hsiang, Wei-Chih Wen, Yin-Hao Wu, Wu-Wei Tsai, Hai-Ching Chen, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20240113222
    Abstract: Some embodiments relate to a thin film transistor comprising an active layer over a substrate. An insulator is stacked with the active layer. A gate electrode structure is stacked with the insulator and includes a gate material layer having a first work function and a first interfacial layer. The first interfacial layer is directly between the insulator and the gate material layer, wherein the gate electrode structure has a second work function that is different from the first work function.
    Type: Application
    Filed: January 3, 2023
    Publication date: April 4, 2024
    Inventors: Yan-Yi Chen, Wu-Wei Tsai, Yu-Ming Hsiang, Hai-Ching Chen, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20240038854
    Abstract: A semiconductor structure includes an active layer, a first gate insulator layer disposed over the active layer, a first gate layer disposed over the gate insulator layer, at least one charged layer disposed between the first gate insulator layer and the active layer, and a pair of contact structures disposed over the active layer. The at least one charged layer includes an oxide material.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wu-Wei Tsai, Yan-Yi Chen, Yu-Ming Hsiang, Hai-Ching Chen, Chung-Te Lin
  • Publication number: 20240008287
    Abstract: A memory device and a manufacturing method thereof is described. The memory device includes a transistor structure over a substrate and a ferroelectric capacitor structure electrically connected with the transistor structure. The ferroelectric capacitor structure includes a top electrode layer, a bottom electrode layer and a ferroelectric stack sandwiched there-between. The ferroelectric stack includes a first ferroelectric layer, a first stabilizing layer, and one of a second ferroelectric layer or a second stabilizing layer. Materials of the first stabilizing layer and a second stabilizing layer include a metal oxide material.
    Type: Application
    Filed: July 4, 2022
    Publication date: January 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Ting Lin, Wei-Chih Wen, Kai-Wen Cheng, Wu-Wei Tsai, Yu-Ming Hsiang, Yan-Yi Chen, Hai-Ching Chen, Yu-Ming Lin, Chung-Te Lin