Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: An intraocular pressure inspection device includes an intraocular pressure detection unit, a high-precision positioning system and a wide-area positioning system, wherein according to the position of the intraocular pressure detection unit, a set of high-precision coordinates output by the high-precision positioning system and a set of wide-area coordinates output by the wide-area positioning system are integrated in appropriate weights to obtain a set of more precise integrated coordinate. The above-mentioned intraocular pressure inspection device can prevent the intraocular pressure detection unit from failing to operate once it is not in the working area of the high-precision positioning system.

Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first active region extending lengthwise along a first direction and having a first width along a second direction perpendicular to the first direction, a second active region extending lengthwise along the first direction and having a second width along the second direction, and an epitaxial feature sandwiched between the first active region and the second active region along the first direction. The first width is greater than the second width.

Abstract: An information handling system having a reconfigurable cooling fan holder including a plurality of cooling fans of a cooling system operatively coupled to the reconfigurable cooling fan holder, a reconfigurable frame having a plurality of slidingly adjustable walls including a pair of lengthwise slidingly adjustable walls and a widthwise slidingly adjustable wall where the pair of lengthwise slidingly adjustable walls may be expanded or reduced in length by sliding the at least two slide bars nested adjacent to one another forming each lengthwise slidingly adjustable wall to extend or contract each lengthwise slidingly adjustable wall, and the widthwise slidingly adjustable wall may be expanded or reduced in width by sliding the at least two slide bars nested adjacent to one another forming the widthwise slidingly adjustable wall to extend or contract the widthwise slidingly adjustable wall for adjusting the width and length of the reconfigurable cooling fan holder.

Abstract: In one or more embodiments, an information handling system may include: at least one processor; a memory medium, communicatively coupled to the at least one processor, that stores an operating system and at least one application executable by the at least one processor; a chassis; an information handling system card port communicatively coupled to the at least one processor; a support device fastened to the chassis; and an expansion card coupled to the information handling system card port and fastened to the support device. In one or more embodiments, the support device may include an opening that permits air to pass through. In one or more embodiments, the support device may include a cover configured to obscure airflow through the opening of the support device. For example, the cover may be configured to unroll to obscure airflow through the opening of the support device.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A cooling system for an information handling system comprises a fan with a sunflower type heat exchanger having two heat exchanger bodies separated by a gap and rotationally offset an angle sized such that a fin of the first heat exchanger body is aligned relative to a channel between two adjacent fins of the second heat exchanger body. As airflow flows through channels between adjacent fins of the first heat exchanger body, the air temperature increases. Air exiting the first heat exchanger body mixes with a second airflow entering the gap between the two heat exchanger bodies and the combined airflow is cooler and turbulent for additional heat absorbing capability for improved cooling.

Abstract: Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

Abstract: An expansion card holder assembly that accepts different size expansion cards is disclosed. The expansion card holder assembly includes a metal base with grooves that roller features of a metal slide bracket fit into. The metal slide bracket is positioned along the metal base for different size expansion cards. The metal slide bracket is connected with a metal cover that is opened to accept expansions cards. A connector is provided for the expansion card to connect with printed circuit board.

Abstract: An expansion card holder assembly that accepts different size expansion cards is disclosed. The expansion card holder assembly includes a metal base with grooves that roller features of a metal slide bracket fit into. The metal slide bracket is positioned along the metal base for different size expansion cards. The metal slide bracket is connected with a metal cover that is opened to accept expansions cards. A connector is provided for the expansion card to connect with printed circuit board.

Abstract: Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

Abstract: Cooling system components are provided herein to direct airflow within an information handling system. More specifically, various embodiments of fin structures are provided herein to direct airflow in at least two different directions. In one embodiment, the fin structure includes a plurality of fins arranged parallel to one another, where at least one integrated airflow guiding structure is formed within each of the plurality of fins. The plurality of fins function to dissipate thermal energy, which is generated by a heat generating component and conducted by a heat sink to the fin structure via convection. As air flows through the plurality of fins in a primary airflow direction, the at least one integrated airflow guiding structure redirects a portion of the airflow in a direction, which differs from the primary airflow direction.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.