Patents by Inventor Yu MIURA

Yu MIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938226
    Abstract: The present invention relates generally to compositions and methods comprising abiotic, synthetic polymers with affinity and specificity to proteins. The synthetic polymers are an improvement over biological agents by providing a simpler, less expensive, and customizable platform for binding to proteins. In one embodiment, the compositions and methods relate to synthetic polymers with affinity and specificity to vascular endothelial growth factor (VEGF). In one embodiment, the compositions are useful for treating diseases and disorders related to the overexpression of VEGF. In one embodiment, the compositions are useful for treating cancer. In one embodiment, the compositions are useful for detecting VEGF levels from biological samples. In one embodiment, the compositions are useful for detecting overexpression of VEGF from biological samples. In one embodiment, the compositions are used to diagnose cancer.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: March 26, 2024
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Kenneth J. Shea, Hiroyuki Koide, Yoshiko Miura, Yu Hoshino, Yuri Nishimura, Naoto Oku
  • Patent number: 11942708
    Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 26, 2024
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masanori Hirata, Shunsuke Aoyama, Yu Miura, Kenji Kiya
  • Patent number: 11569042
    Abstract: A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: January 31, 2023
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
  • Publication number: 20220294135
    Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.
    Type: Application
    Filed: November 15, 2021
    Publication date: September 15, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masanori HIRATA, Shunsuke AOYAMA, Yu MIURA, Kenji KIYA
  • Publication number: 20210313719
    Abstract: A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a part of the circuit. A part of the circuit is exposed without the cover film being provided in a partial region of the flexible printed wiring board, and at least some of the crimping pieces are arranged in the partial region, and thus bite into a part of the circuit without penetrating the cover film.
    Type: Application
    Filed: February 23, 2021
    Publication date: October 7, 2021
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shuzo YAMADA, Yu MIURA, Tomoki KANAYAMA
  • Patent number: 11011316
    Abstract: An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 18, 2021
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
  • Publication number: 20210142950
    Abstract: A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.
    Type: Application
    Filed: January 21, 2021
    Publication date: May 13, 2021
    Applicant: NIPPON CHEMI-CON CORPORATION
    Inventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
  • Patent number: 10717792
    Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: July 21, 2020
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yu Miura, Yasutoyo Kawashima, Kohei Ueda, Yoshinobu Nozue
  • Publication number: 20190309109
    Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 10, 2019
    Inventors: Yu MIURA, Yasutoyo KAWASHIMA, Kohei UEDA, Yoshinobu NOZUE
  • Patent number: 10370467
    Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: August 6, 2019
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yu Miura, Yasutoyo Kawashima, Kohei Ueda, Yoshinobu Nozue
  • Publication number: 20190198251
    Abstract: An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.
    Type: Application
    Filed: September 28, 2017
    Publication date: June 27, 2019
    Applicant: NIPPON CHEMI-CON CORPORATION
    Inventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
  • Patent number: 10174236
    Abstract: A heat storage material composition that is excellent in shape retention and bleed resistance is provided. The heat storage material composition is obtained by heat-treating Component (A), Polymer (B-1) and Polymer (B-2) together. Component (A) is a polyhydric alcohol not having constitutional units derived from any vinyl monomers. Polymer (B-1) is a polymer composed mainly of constitutional units derived from acrylic acid or a salt thereof, a polymer composed mainly of constitutional units derived from methacrylic acid or a salt thereof, or a mixture thereof, excluding a polymer having two or more hydroxy groups in one polymer chain. Polymer (B-2) is a polymer composed mainly of constitutional units derived from a vinyl monomer, and having two or more hydroxy groups in one polymer chain.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: January 8, 2019
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yu Miura, Nobuhiro Oosaki, Yoshinobu Nozue
  • Publication number: 20180030175
    Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.
    Type: Application
    Filed: December 10, 2015
    Publication date: February 1, 2018
    Inventors: Yu MIURA, Yasutoyo KAWASHIMA, Kohei UEDA, Yoshinobu NOZUE
  • Publication number: 20170088761
    Abstract: A heat storage material composition that is excellent in shape retention and bleed resistance is provided. The heat storage material composition is obtained by heat-treating Component (A), Polymer (B-1) and Polymer (B-2) together. Component (A) is a polyhydric alcohol not having constitutional units derived from any vinyl monomers. Polymer (B-1) is a polymer composed mainly of constitutional units derived from acrylic acid or a salt thereof, a polymer composed mainly of constitutional units derived from methacrylic acid or a salt thereof, or a mixture thereof, excluding a polymer having two or more hydroxy groups in one polymer chain. Polymer (B-2) is a polymer composed mainly of constitutional units derived from a vinyl monomer, and having two or more hydroxy groups in one polymer chain.
    Type: Application
    Filed: March 19, 2015
    Publication date: March 30, 2017
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Yu MIURA, Nobuhiro OOSAKI, Yoshinobu NOZUE
  • Publication number: 20110217538
    Abstract: A thermoplastic elastomer composition for injection molding is provided that includes component (A), component (B), component (C) and component (D) below, relative to 100 parts by weight of component (A), component (B) having a content of 5 to 150 parts by weight, component (C) having a content of 5 to 300 parts by weight, and component (D) having a content of 5 to 150 parts by weight. (A): A hydrogenated product of a block copolymer composed of a block (a) composed of an aromatic vinyl compound-based monomer unit, and a block (b) composed of a conjugated diene compound-based monomer unit, having a 1,2-bond content of not less than 60%, (B): a propylene-based resin, (C): a mineral oil softener, and (D): an ethylene-propylene copolymer rubber having a Mooney viscosity (ML1+4, 100° C.) of 20 to 200, an ethylene-based monomer unit having a content of 40 to 80 wt % (relative to 100 wt % of the copolymer rubber).
    Type: Application
    Filed: March 2, 2011
    Publication date: September 8, 2011
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yu MIURA, Yuya YAMAMOTO