Patents by Inventor Yu MIURA
Yu MIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11938226Abstract: The present invention relates generally to compositions and methods comprising abiotic, synthetic polymers with affinity and specificity to proteins. The synthetic polymers are an improvement over biological agents by providing a simpler, less expensive, and customizable platform for binding to proteins. In one embodiment, the compositions and methods relate to synthetic polymers with affinity and specificity to vascular endothelial growth factor (VEGF). In one embodiment, the compositions are useful for treating diseases and disorders related to the overexpression of VEGF. In one embodiment, the compositions are useful for treating cancer. In one embodiment, the compositions are useful for detecting VEGF levels from biological samples. In one embodiment, the compositions are useful for detecting overexpression of VEGF from biological samples. In one embodiment, the compositions are used to diagnose cancer.Type: GrantFiled: September 23, 2022Date of Patent: March 26, 2024Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Kenneth J. Shea, Hiroyuki Koide, Yoshiko Miura, Yu Hoshino, Yuri Nishimura, Naoto Oku
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Patent number: 11942708Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.Type: GrantFiled: November 15, 2021Date of Patent: March 26, 2024Assignee: NIPPON MEKTRON, LTD.Inventors: Masanori Hirata, Shunsuke Aoyama, Yu Miura, Kenji Kiya
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Patent number: 11569042Abstract: A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.Type: GrantFiled: January 21, 2021Date of Patent: January 31, 2023Assignee: NIPPON CHEMI-CON CORPORATIONInventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
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Publication number: 20220294135Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.Type: ApplicationFiled: November 15, 2021Publication date: September 15, 2022Applicant: NIPPON MEKTRON, LTD.Inventors: Masanori HIRATA, Shunsuke AOYAMA, Yu MIURA, Kenji KIYA
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Publication number: 20210313719Abstract: A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a part of the circuit. A part of the circuit is exposed without the cover film being provided in a partial region of the flexible printed wiring board, and at least some of the crimping pieces are arranged in the partial region, and thus bite into a part of the circuit without penetrating the cover film.Type: ApplicationFiled: February 23, 2021Publication date: October 7, 2021Applicant: NIPPON MEKTRON, LTD.Inventors: Shuzo YAMADA, Yu MIURA, Tomoki KANAYAMA
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Patent number: 11011316Abstract: An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.Type: GrantFiled: September 28, 2017Date of Patent: May 18, 2021Assignee: NIPPON CHEMI-CON CORPORATIONInventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
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Publication number: 20210142950Abstract: A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.Type: ApplicationFiled: January 21, 2021Publication date: May 13, 2021Applicant: NIPPON CHEMI-CON CORPORATIONInventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
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Patent number: 10717792Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.Type: GrantFiled: June 14, 2019Date of Patent: July 21, 2020Assignee: Sumitomo Chemical Company, LimitedInventors: Yu Miura, Yasutoyo Kawashima, Kohei Ueda, Yoshinobu Nozue
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Publication number: 20190309109Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.Type: ApplicationFiled: June 14, 2019Publication date: October 10, 2019Inventors: Yu MIURA, Yasutoyo KAWASHIMA, Kohei UEDA, Yoshinobu NOZUE
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Patent number: 10370467Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.Type: GrantFiled: December 10, 2015Date of Patent: August 6, 2019Assignee: Sumitomo Chemical Company, LimitedInventors: Yu Miura, Yasutoyo Kawashima, Kohei Ueda, Yoshinobu Nozue
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Publication number: 20190198251Abstract: An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.Type: ApplicationFiled: September 28, 2017Publication date: June 27, 2019Applicant: NIPPON CHEMI-CON CORPORATIONInventors: Ryuuta Inoue, Yu Miura, Kouichi Nakata
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Patent number: 10174236Abstract: A heat storage material composition that is excellent in shape retention and bleed resistance is provided. The heat storage material composition is obtained by heat-treating Component (A), Polymer (B-1) and Polymer (B-2) together. Component (A) is a polyhydric alcohol not having constitutional units derived from any vinyl monomers. Polymer (B-1) is a polymer composed mainly of constitutional units derived from acrylic acid or a salt thereof, a polymer composed mainly of constitutional units derived from methacrylic acid or a salt thereof, or a mixture thereof, excluding a polymer having two or more hydroxy groups in one polymer chain. Polymer (B-2) is a polymer composed mainly of constitutional units derived from a vinyl monomer, and having two or more hydroxy groups in one polymer chain.Type: GrantFiled: March 19, 2015Date of Patent: January 8, 2019Assignee: Sumitomo Chemical Company, LimitedInventors: Yu Miura, Nobuhiro Oosaki, Yoshinobu Nozue
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Publication number: 20180030175Abstract: A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.Type: ApplicationFiled: December 10, 2015Publication date: February 1, 2018Inventors: Yu MIURA, Yasutoyo KAWASHIMA, Kohei UEDA, Yoshinobu NOZUE
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Publication number: 20170088761Abstract: A heat storage material composition that is excellent in shape retention and bleed resistance is provided. The heat storage material composition is obtained by heat-treating Component (A), Polymer (B-1) and Polymer (B-2) together. Component (A) is a polyhydric alcohol not having constitutional units derived from any vinyl monomers. Polymer (B-1) is a polymer composed mainly of constitutional units derived from acrylic acid or a salt thereof, a polymer composed mainly of constitutional units derived from methacrylic acid or a salt thereof, or a mixture thereof, excluding a polymer having two or more hydroxy groups in one polymer chain. Polymer (B-2) is a polymer composed mainly of constitutional units derived from a vinyl monomer, and having two or more hydroxy groups in one polymer chain.Type: ApplicationFiled: March 19, 2015Publication date: March 30, 2017Applicant: Sumitomo Chemical Company, LimitedInventors: Yu MIURA, Nobuhiro OOSAKI, Yoshinobu NOZUE
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Publication number: 20110217538Abstract: A thermoplastic elastomer composition for injection molding is provided that includes component (A), component (B), component (C) and component (D) below, relative to 100 parts by weight of component (A), component (B) having a content of 5 to 150 parts by weight, component (C) having a content of 5 to 300 parts by weight, and component (D) having a content of 5 to 150 parts by weight. (A): A hydrogenated product of a block copolymer composed of a block (a) composed of an aromatic vinyl compound-based monomer unit, and a block (b) composed of a conjugated diene compound-based monomer unit, having a 1,2-bond content of not less than 60%, (B): a propylene-based resin, (C): a mineral oil softener, and (D): an ethylene-propylene copolymer rubber having a Mooney viscosity (ML1+4, 100° C.) of 20 to 200, an ethylene-based monomer unit having a content of 40 to 80 wt % (relative to 100 wt % of the copolymer rubber).Type: ApplicationFiled: March 2, 2011Publication date: September 8, 2011Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Yu MIURA, Yuya YAMAMOTO