Patents by Inventor Yu Murano
Yu Murano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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TREATMENT PORTION OF MEDICAL ENERGY DEVICE, MANUFACTURING METHOD THEREFOR, AND MEDICAL ENERGY DEVICE
Publication number: 20230355291Abstract: This treatment portion of a medical energy device treats a biological tissue by transferring energy to the biological tissue, in a state where the treatment portion is in contact with the biological tissue. The treatment portion of the medical energy device includes a main body portion and a covering film. The main body portion transfers energy to the biological tissue. The covering film contains silicone as a main component, and covers the surface of the main body portion. The silicone includes at least a D unit and a T unit. In the silicone, the molar ratio of silicon atoms forming the D unit with respect to all the silicon atoms is 40-99%. In the silicone, the molar ratio of methyl functional groups bonded to the silicon atoms with respect to all functional groups bonded to the silicon atoms is at least 60%.Type: ApplicationFiled: July 6, 2023Publication date: November 9, 2023Applicant: OLYMPUS CORPORATIONInventors: Yoshiyuki OGAWA, Hiroaki KASAI, Takuya FUJIHARA, Yu MURANO, Issei MAEDA, Asuka TACHIKAWA -
Patent number: 11596719Abstract: This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.Type: GrantFiled: August 20, 2018Date of Patent: March 7, 2023Assignee: OLYMPUS CORPORATIONInventors: Yu Murano, Takuya Fujihara, Takeshi Deguchi, Hiroaki Kasai, Kohei Shiramizu
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Publication number: 20200205880Abstract: An electrode for high frequency medical device includes: a base; and a coating layer which is laminated onto the base, includes at least either one of a fluororesin and a silicon compound, has a volume resistivity of 1.0×100 to 1.0×1013?·×cm, and has a thickness of 1 to 30 ?m. The electrode is configured to denature and dissect a living tissue by a Joule heating due to a high frequency current and an arc discharge.Type: ApplicationFiled: March 6, 2020Publication date: July 2, 2020Applicant: OLYMPUS CORPORATIONInventors: Hiroaki KASAI, Yu MURANO, Yoshiyuki OGAWA, Takuya FUJIHARA
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Publication number: 20200164115Abstract: An electrode for high-frequency medical device, has a substrate; an intermediate layer laminated on the substrate, wherein the intermediate layer has a top layer formed on the outermost part of the intermediate layer and the top layer is formed from a metal layer having a higher thermal conductivity than that of the substrate; and a coating layer laminated on the intermediate layer, wherein the coating layer is configured such that a plurality of metal particles having a thermal conductivity equal to or larger than 250 W/(m·K) are distributed in a nonmetal material.Type: ApplicationFiled: January 31, 2020Publication date: May 28, 2020Applicant: OLYMPUS CORPORATIONInventors: Yu MURANO, Yoshiyuki OGAWA, Hiroaki KASAI, Takuya FUJIHARA
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Publication number: 20190282806Abstract: A high-frequency electrode for a medical device includes an electrode base material and an oxide. The electrode base material is made of a metal or an alloy. The oxide is added into the electrode base material. The metal or alloy has a melting point of 2000° C. or higher. The oxide has a particle diameter of 2 ?m or more.Type: ApplicationFiled: June 6, 2019Publication date: September 19, 2019Applicant: OLYMPUS CORPORATIONInventors: Kentaro TSUDA, Hiroaki KASAI, Takuya FUJIHARA, Yu MURANO
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Patent number: 10350679Abstract: In a fine silver particle dispersing solution wherein 30 to 75% by weight of fine silver particles, which are coated with an organic acid having a carbon number of 5 to 8 or a derivative thereof and which have an average particle diameter of 1 to 100 nm, are dispersed in a water-based dispersion medium which is a solvent containing water as a main component, the fine silver particle dispersing solution containing ammonia and nitric acid, there is added 0.15 to 0.6% by weight of a surface regulating agent, which preferably contains a polyether-modified polydimethylsiloxane and a polyoxyethylene alkyl ether or a polyether, or 0.005 to 0.6% by weight of an antifoaming agent which is preferably a silicone antifoaming agent.Type: GrantFiled: May 12, 2015Date of Patent: July 16, 2019Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yu Murano, Hidefumi Fujita, Daisuke Itoh, Shuji Yamashita, Daiki Yoshihara
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Publication number: 20190192212Abstract: A conductive adhesion preventing film for medical use, includes: a nonconductive base material; and a linear conductor having a length of 10 ?m or more and a diameter of more than 50 nm and contained in the conductive adhesion preventing film by an amount of 5% by mass or more and 40% by mass or less, wherein the conductive adhesion preventing film is formed on an electrode surface of a medical device performing at least one of incision, resection, coagulation, and ablation on living tissue by applying a high frequency voltage.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Applicant: OLYMPUS CORPORATIONInventors: Yu MURANO, Takuya FUJIHARA, Hiroaki KASAI, Takeshi DEGUCHI
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Publication number: 20180353658Abstract: This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.Type: ApplicationFiled: August 20, 2018Publication date: December 13, 2018Applicant: OLYMPUS CORPORATIONInventors: Yu MURANO, Takuya FUJIHARA, Takeshi DEGUCHI, Hiroaki KASAI, Kohei SHIRAMIZU
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Publication number: 20170362455Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.Type: ApplicationFiled: January 6, 2016Publication date: December 21, 2017Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Hidefumi Fujita, Shuji Kaneda, Yu Murano, Daisuke Itoh
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Publication number: 20170087633Abstract: In a fine silver particle dispersing solution wherein 30 to 75% by weight of fine silver particles, which are coated with an organic acid having a carbon number of 5 to 8 or a derivative thereof and which have an average particle diameter of 1 to 100 nm, are dispersed in a water-based dispersion medium which is a solvent containing water as a main component, the fine silver particle dispersing solution containing ammonia and nitric acid, there is added 0.15 to 0.6% by weight of a surface regulating agent, which preferably contains a polyether-modified polydimethylsiloxane and a polyoxyethylene alkyl ether or a polyether, or 0.005 to 0.6% by weight of an antifoaming agent which is preferably a silicone antifoaming agent.Type: ApplicationFiled: May 12, 2015Publication date: March 30, 2017Inventors: Yu Murano, Hidefumi Fujita, Daisuke Itoh, Shuji Yamashita, Daiki Yoshihara
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Patent number: 9537202Abstract: A silver particle dispersing solution, which contains 50-70% by weight of silver particles having an average particle diameter of 20 nm or less, is applied on a substrate by the flexographic printing, and then, calcined to produce a booster antenna wherein a silver conductive film, which contains 10-50% by volume of a sintered body of the silver particles and which has a volume resistivity of 3-100 ??·cm, a surface resistivity of 0.5?/? or less and a thickness of 1-6 ?m, is formed on the substrate. Thus, there is provided a booster antenna which has excellent electrical characteristics and flexibility and which can be inexpensively mass-produced.Type: GrantFiled: February 1, 2013Date of Patent: January 3, 2017Assignee: Dowa Electronics Materials Co. Ltd.Inventors: Daisuke Itoh, Hidefumi Fujita, Yu Murano, Shinichi Konno
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Publication number: 20150102964Abstract: A silver particle dispersing solution, which contains 50-70% by weight of silver particles having an average particle diameter of 20 nm or less, is applied on a substrate by the flexographic printing, and then, calcined to produce a booster antenna wherein a silver conductive film, which contains 10-50% by volume of a sintered body of the silver particles and which has a volume resistivity of 3-100 ??·cm, a surface resistivity of 0.5?/? or less and a thickness of 1-6 ?m, is formed on the substrate. Thus, there is provided a booster antenna which has excellent electrical characteristics and flexibility and which can be inexpensively mass-produced.Type: ApplicationFiled: February 1, 2013Publication date: April 16, 2015Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Daisuke Itoh, Hidefumi Fujita, Yu Murano, Shinichi Konno