Abstract: An electric lock includes a housing, a manual control member rotatably affixed to the housing, and a clutch mechanism. The clutch mechanism includes a clutch base rotatably affixed to the housing; a retractable plug arranged on the clutch base, wherein the retractable plug is radially movable relative to the clutch base; a driving member abutting against a first end of the retractable plug; and a motor configured to drive the driving member to move relative to the clutch base toward the shaft of the manual control member.

Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: A semiconductor device includes a bridge and a first integrated circuit. The bridge is free of active devices and includes a first conductive connector. The first integrated circuit includes a substrate and a second conductive connector disposed in a first dielectric layer over the substrate. The second conductive connector is directly bonded to the first conductive connector. The second conductive connector includes conductive pads and first conductive vias and a second conductive via between the conductive pads. The second conductive via is not overlapped with the first conductive vias while the first conductive vias are overlapped with one another. A vertical distance between the second conductive via and the first conductive connector is larger than a vertical distance between each of the first conductive vias and the first conductive connector, and a sidewall of the first dielectric layer is substantially flush with a sidewall of the substrate.

Abstract: An electrochromic composition including: a first oxidizable compound; a reducible compound; an electrolyte; and a solvent, wherein the first oxidizable compound is represented by the following formula: wherein X1, and X2 are independently substituted or unsubstituted aliphatic hydrocarbon groups, or substituted or unsubstituted aromatic hydrocarbon groups, wherein the aromatic hydrocarbon groups include: wherein each Rx is independently hydrogen, a C1-C16 alkyl group, a C1-C16 alkoxy group, a C1-C16 haloalkyl group, or halogen.

Abstract: A semiconductor package includes a substrate and at least one integrated circuit (IC) die. Substrate solder resist has substrate solder resist openings exposing substrate bonding pads of the bonding surface of the substrate, and die solder resist has aligned die solder resist openings exposing die bonding pads of the bonding surface of the IC die. A ball grid array (BGA) electrically connects the die bonding pads with substrate bonding pads via the die solder resist openings and the substrate solder resist openings. The die solder resist openings include a subset A of the die solder resist openings in a region A of the bonding surface of the IC die and a subset B of the die solder resist openings in a region B of the bonding surface of the IC die. The die solder resist openings of subset A are larger than those of subset B.

Abstract: A wireless communication device for a transmission end of a wireless communication system is provided. The wireless communication device includes a wireless analog transmission unit, for transmitting a data packet on a data transmission channel; and a packet generating unit, for generating the data packet and at least one protection packet; wherein before transmitting the data packet on the data transmission channel, the wireless communication device transmits the at least one protection packet on at least one adjacent channel of the data transmission channel to indicate to at least one user of the at least one adjacent channel to stop using the at least one adjacent channel before transmission of the data packet is completed, and at least one frequency band of the at least one adjacent channel overlaps a frequency band of the data transmission channel.

Abstract: A communication device includes a radio transceiver and a collision detection device. The radio transceiver is configured to receive a wireless signal which includes an acknowledgment packet from a wireless communication channel. The acknowledgment packet includes acknowledgment information which corresponds to a plurality of transmitted packets. The collision detection device is coupled to the radio transceiver and configured to receive the acknowledgment packet, determine whether collision has occurred in the wireless communication channel according to the acknowledgment information corresponding to the transmitted packets and accordingly generate a detection result. The collision detection device determines whether collision has occurred according to a distribution of the acknowledgment information having a predetermined acknowledgment status.

Abstract: A communication device includes a radio transceiver and a collision detection device. The radio transceiver is configured to receive a wireless signal which includes an acknowledgment packet from a wireless communication channel. The acknowledgment packet includes acknowledgment information which corresponds to a plurality of transmitted packets. The collision detection device is coupled to the radio transceiver and configured to receive the acknowledgment packet, determine whether collision has occurred in the wireless communication channel according to the acknowledgment information corresponding to the transmitted packets and accordingly generate a detection result. The collision detection device determines whether collision has occurred according to a distribution of the acknowledgment information having a predetermined acknowledgment status.

Abstract: A wireless communication device for a transmission end of a wireless communication system is provided. The wireless communication device includes a wireless analog transmission unit, for transmitting a data packet on a data transmission channel; and a packet generating unit, for generating the data packet and at least one protection packet; wherein before transmitting the data packet on the data transmission channel, the wireless communication device transmits the at least one protection packet on at least one adjacent channel of the data transmission channel to indicate to at least one user of the at least one adjacent channel to stop using the at least one adjacent channel before transmission of the data packet is completed, and at least one frequency band of the at least one adjacent channel overlaps a frequency band of the data transmission channel.

Abstract: This invention discloses a method for controlling a wireless communication device to reduce the number of retry times of data packets during transmission. The method includes steps of: using a first packet length to generate and transmit data packets; counting retry times of data packets in a predetermined time period and generating a result accordingly; and using a second packet length smaller than said first packet length to generate and transmit data packets when said result is greater than a predetermined value.

Abstract: A method and apparatus for performing dynamic statistical period adjustment regarding rate adaption (RA) are provided. The method includes: collecting respective transmission results of multiple data packets to perform parallel processing, where the parallel processing includes statistical period control and RA control. The statistical period control includes: determining whether a first loop index reaches a monitored period threshold; performing first transmitting (TX) information statistics; calculating variance of TX information statistics results; and selectively adjusting a statistical period threshold. The RA control includes: determining whether a second loop index reaches the statistical period threshold; performing second TX information statistics; and performing the RA. The statistical period control may dynamically adjust the statistical period of the RA control, to enhance transmission efficiency of the wireless communications device.

Abstract: A method and apparatus for performing dynamic statistical period adjustment regarding rate adaption (RA) are provided. The method includes: collecting respective transmission results of multiple data packets to perform parallel processing, where the parallel processing includes statistical period control and RA control. The statistical period control includes: determining whether a first loop index reaches a monitored period threshold; performing first transmitting (TX) information statistics; calculating variance of TX information statistics results; and selectively adjusting a statistical period threshold. The RA control includes: determining whether a second loop index reaches the statistical period threshold; performing second TX information statistics; and performing the RA. The statistical period control may dynamically adjust the statistical period of the RA control, to enhance transmission efficiency of the wireless communications device.

Abstract: This invention discloses a method for controlling a wireless communication device to reduce the number of retry times of data packets during transmission. The method includes steps of: using a first packet length to generate and transmit data packets; counting retry times of data packets in a predetermined time period and generating a result accordingly; and using a second packet length smaller than said first packet length to generate and transmit data packets when said result is greater than a predetermined value.

Abstract: This invention discloses a method for controlling a wireless communication device to transmit data packets. The method includes steps of: transmitting data packets; counting retry times of data packets in a predetermined time period and generating a result accordingly; comparing said result with a predetermined value and generating a comparison result accordingly; and reducing transmission time of data packets according to said comparison result.

Abstract: A hinge structure including an axis body, a torque member, and a pressing assembly is provided. The axis body includes a contact surface. The torque member leans against the contact surface of the axis body. The torque member and the axis body are rotatable relatively around a central axis of the axis body. The contact surface pushes the torque member to move around the central axis of the axis body when the torque member and the axis body rotate relatively. The pressing assembly provides a pushing force to the torque member to push the torque member to push towards the contact surface. A plurality of electronic devices having the hinge structure are further provided.

Abstract: The present invention discloses a gain adjustment method for wireless communication. This method is carried out by a wireless transceiver, and an embodiment of the method comprises the following steps: obtaining at least one transceiving parameter of a wireless connection partner; determining an adaptive power gain according to the at least one transceiving parameter; having an idle power gain of a radio-frequency circuit of the wireless transceiver be the adaptive power gain for a period of time, or having the idle power gain of the radio-frequency circuit be the adaptive power gain until packet transmission operation or packet reception operation takes place within the period of time; and if none of the packet transmission operation and the packet reception operation takes place within the period of time, having the idle power gain of the radio-frequency circuit be an initial power gain right after the period of time.

Abstract: The present invention discloses a gain adjustment method for wireless communication. This method is carried out by a wireless transceiver, and an embodiment of the method comprises the following steps: obtaining at least one transceiving parameter of a wireless connection partner; determining an adaptive power gain according to the at least one transceiving parameter; having an idle power gain of a radio-frequency circuit of the wireless transceiver be the adaptive power gain for a period of time, or having the idle power gain of the radio-frequency circuit be the adaptive power gain until packet transmission operation or packet reception operation takes place within the period of time; and if none of the packet transmission operation and the packet reception operation takes place within the period of time, having the idle power gain of the radio-frequency circuit be an initial power gain right after the period of time.

Abstract: A hinge structure including an axis body, a torque member, and a pressing assembly is provided. The axis body includes a contact surface. The torque member leans against the contact surface of the axis body. The torque member and the axis body are rotatable relatively around a central axis of the axis body. The contact surface pushes the torque member to move around the central axis of the axis body when the torque member and the axis body rotate relatively. The pressing assembly provides a pushing force to the torque member to push the torque member to push towards the contact surface. A plurality of electronic devices having the hinge structure are further provided.

Abstract: A system for evaluating all functions of a mobile phone to benefit recycling purposes includes a robotic arm assembly, a camera test device, a touch test device, and a 3D Touch test device. The camera test device has a backlight screen and a target picture. The touch test device has at least one first stylus for applying input to a touch screen of a mobile phone. The 3D Touch test device has at least one second stylus for applying strong presses to the touch screen of the mobile phone. The robotic arm assembly can also move the mobile phone to enable image-capturing. A method for functionality-testing is also provided.