Abstract: A biochip packaging structure includes a chip packaging layer, a redistribution layer, and a microfluidic channel. The chip packaging layer includes a resin layer including a biochip and a conductive pillar located on each of two sides of the biochip. The biochip includes a first surface flush with and exposed out of a side of the resin layer. A first end of the conductive pillar is flush with a side of the resin layer opposite the biochip. A second end of the conductive pillar is flush with the first surface of the biochip. The redistribution layer includes a metal winding electrically coupled to the biochip and the adjacent conductive pillar. The metal winding includes a first winding portion coupled to the biochip and a second winding portion coupled between the first winding portion and the conductive pillar. The second winding portion is parallel to the first surface.

Abstract: An all-in-one computer includes a monitor and a host. The monitor includes a display screen, which has an accommodating cavity with an opening located on a peripheral side of the display screen, and the host is detachably mounted in the accommodating cavity from the opening along a first direction. The monitor is provided with a first connecting assembly, the host is provided with a second connecting assembly, and when the host is mounted in the accommodating cavity, the second connecting assembly is connected to the first connecting assembly to implement signal transmission between the host and the monitor. An arrangement direction of the second connecting assembly and the first connecting assembly is perpendicular to the first direction, and the arrangement direction of the second connecting assembly and the first connecting assembly is parallel to a plane on which the display screen is located.

Abstract: Provided is a noninvasive hemoglobin detector, including an image acquisition system, an image processing and analysis system and a printing device. The image acquisition system is connected with the image processing and analysis system, and the image acquisition system is used for acquiring, transmitting and storing an image to be tested. The image processing and analysis system is further connected with the printing device, and the image processing and analysis system is used for processing and analyzing the image to be tested to obtain an analysis result. The printing device is used for printing the image to be tested and the analysis result.

Abstract: Described is a system for producing indicators and warnings of adversarial activities. The system receives multiple networks of transactional data from different sources. Each node of a network of transactional data represents an entity, and each edge represents a relation between entities. A worldview graph is generated by merging the multiple networks of transactional data. Suspicious subgraph regions related to an adversarial activity are identified in the worldview graph through activity detection. The suspicious subgraph regions are used to generate and transmit an alert of the adversarial activity.

Abstract: Described is a system for detecting adversarial activities. During operation, the system generates a multi-layer temporal graph tensor (MTGT) representation based on an input tag stream of activities. The MTGT representation is decomposed to identify normal activities and abnormal activities, with the abnormal activities being designated as adversarial activities. A device can then be controlled based on the designation of the adversarial activities.

Abstract: A package structure includes a first chip, a first redistribution layer, a second chip, a second redistribution layer, a third redistribution layer, a carrier, and a first molding compound layer. The first redistribution layer is arranged on a surface of the first chip. The second redistribution layer is arranged on a surface of the second chip. The third redistribution layer interconnects the first redistribution layer and the second redistribution layer. The carrier is arranged on a side of the third redistribution layer away from the first redistribution layer and the second redistribution layer. The first molding compound layer covers the first chip, the first redistribution layer, the second chip, and the second redistribution layer. A manufacturing method is also disclosed.

Abstract: A semiconductor packaging structure manufactured in a manner which does not leave the chip damaged or susceptible to damage upon the removal of temporary manufacturing supports includes at least one electrical conductor, at least one conductive layer, a chip, and a colloid. The chip is spaced from the conductive layer, the electrical conductor is disposed between the conductive layer and the chip and electrically connects the conductive layer to the chip. The colloid covers all outer surfaces of the chip. A method of fabricating such a semiconductor packaging structure is also provided.

Abstract: A method, apparatus, system, and computer program product for managing a platform. Sensor information for a platform health of the platform is received from a sensor system for the platform. The sensor information for the platform health of the platform is sent by a computer system into a machine learning model trained using historical sensor information indicating a historical platform health and historical context information corresponding to the historical sensor information in which the historical context information is for a set of operating conditions. A remaining useful life of a component in the platform is received by the computer system from the machine learning model.

Abstract: A fan-out packaging structure includes a redistribution layer and a positioning sheet formed on the redistribution layer. The positioning sheet defines at least one opening penetrating opposite sides of the positioning sheet. At least one chip is mounted in the at least one opening. The redistribution layer comprises at least one conductive circuit. The at least one chip is electrically coupled to a corresponding one conductive circuit.

Abstract: A fan-out packaging structure includes a redistribution layer and a positioning sheet formed on the redistribution layer. The positioning sheet defines at least one opening penetrating opposite sides of the positioning sheet. At least one chip is mounted in the at least one opening. The redistribution layer comprises at least one conductive circuit. The at least one chip is electrically coupled to a corresponding one conductive circuit.

Abstract: Described is a system for feature selection that extends supervised hierarchical clustering to neural activity signals. The system generates, using a hierarchical clustering process, a hierarchical dendrogram representing a set of neural activity data comprising individual neural data elements having neural activity patterns. The hierarchical dendrogram is searched for an optimal cluster parcellation using a stochastic supervised search process. An optimal cluster parcellation of the hierarchical dendrogram is determined that provides a classification of the set of neural activity data with respect to a supervised classifier, resulting in a reduced neural activity feature set. The set of neural activity data is classified using the reduced neural activity feature set, and the classified set of neural activity data is decoded.

Abstract: Described is a system for health assessment. The system is implemented on a mobile device having at least one of an accelerometer, a geographic location sensor, and a camera. In operation, the system obtains sensor data related to an operator of the mobile device from one of the sensors. A network of networks (NoN) is generated based on the sensor data, the NoN having a plurality of layers with linked nodes. Tuples are thereafter generated. Each tuple contains a node from each layer that optimizes importance, diversity, and coherence. Storylines are created based on the tuples that solves a longest path problem for each tuple. The storylines track multiple symptom progressions of the operator. Finally, a disease prediction of the operator is provided based on the storylines.

Abstract: Packaging structure includes a first packaging component and a second packaging component arranged in the first packaging component. The packaging component includes a first substrate, a first redistribution layer, a first electronic component, and a first packaging body. The first redistribution layer is arranged on the first substrate. The first electronic component is arranged on the first redistribution layer and electrically coupled to the first redistribution layer. The first packaging body is arranged on the first substrate and covers the first electronic component. The second packaging component includes a second substrate, a second redistribution layer, a second electronic component, and a second packaging body. The redistribution layer is arranged on the second substrate and electrically coupled to the first redistribution layer. The second electronic component is arranged on the second redistribution layer and electrically coupled to the second redistribution layer.

Abstract: A package structure includes a first chip, a first redistribution layer, a second chip, a second redistribution layer, a third redistribution layer, a carrier, and a first molding compound layer. The first redistribution layer is arranged on a surface of the first chip. The second redistribution layer is arranged on a surface of the second chip. The third redistribution layer interconnects the first redistribution layer and the second redistribution layer. The carrier is arranged on a side of the third redistribution layer away from the first redistribution layer and the second redistribution layer. The first molding compound layer covers the first chip, the first redistribution layer, the second chip, and the second redistribution layer. A manufacturing method is also disclosed.

Abstract: A method for making a biochip structure, includes: providing a substrate and forming a plurality of biochips on a surface of the substrate; forming a carrier on a side of the substrate having the biochips, defining a plurality of through holes in the substrate from a side of the substrate away from the carrier; and filling conductive material in each of the through holes to connect one of the biochips. The carrier defines a plurality of openings. Each opening cooperates with substrate to form a micro-channel, and one of the biochips is exposed in the micro-channel.

Abstract: Described is a system for activity and behavior detection in a target system. Raw data extracted from various heterogeneous sources of the target system is fused across spatial and temporal scales into a multi-graph representation. Information flows of the multi-graph representation are analyzed using a set of multi-layer information dynamic measures. Based on the set of multi-layer information dynamic measures, at least one of an economic and social indicator of emerging activity of interest in the target system is derived. The indicator is then used for prediction of future activity of interest in the target system.

Abstract: Described is a system for selecting measurement nodes in a distributed physical system of agents. In operation, the distributed physical system is represented as a multi-layer network having a communication layer and an agent layer. The communication layer represents the amount of collective communication activities between any pair of areas and the agent layer represents movement of agents within the distributed physical system such that the communication layer and agent layer collectively generate network dynamics. The network dynamics are modeled as hybrid partial differential equations (PDEs) with measurable interconnected states in the communication layer. Notably, placement of a minimum set of measurement nodes is determined within the distributed physical system to provide full-state observability of the distributed physical system. The system can then track the full system state and apply compensation to one or more agents in the distributed physical system based on tracking the full system state.

Abstract: Described is a system for predicting future social activity. The system extracts social activities from spatial-temporal social network data collected in a first time period ranging from hours to days to capture spatial structures of social activities in a graph network representation. A graph matching technique is applied over a set of spatial-temporal social network data collected in a second time period ranging from weeks to months to capture temporal structures of the social activities. A spatial-temporal structure of each social activity is represented as an activity core, where each activity core is defined as active nodes that participate in the social activity with a frequency over a predetermined threshold over the second time period. For each activity core, the system computes statistics of the social activity and uses the statistics to generate a prediction of future behaviors of the social activity.

Abstract: Systems and methods according to one or more embodiments are provided for registration of synthetic aperture range profile data to aid in SAR-based navigation. In one example, a SAR-based navigation system includes a memory comprising a plurality of executable instructions. The SAR-based navigation system further includes a processor adapted to receive range profile data associated with observed views of a scene, compare the range profile data to a template range profile data of the scene, and estimate registration parameters associated with the range profile data relative to the template range profile data to determine a deviation from the template range profile data.

Abstract: A fingerprint identification chip package of reduced thickness in not requiring a supporting substrate includes a packaging material layer, a fingerprint identification chip in the packaging material layer, conductive pillars in the packaging material layer for structural support, the pillars being spaced apart from the fingerprint identification chip, and a redistribution layer on a side of the packaging material layer. The redistribution layer includes connecting wires, each wire is electrically coupled between the fingerprint identification chip and one conductive pillar. A plurality of pins is on a side of the packaging material layer opposite to the redistribution layer, each pin is electrically coupled to one conductive pillar.