Patents by Inventor Yu-Nien Hunng

Yu-Nien Hunng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070247814
    Abstract: A heat dissipation module includes a heat dissipation device, a resilient bracket and a cylindrically shaped nut. The heat dissipation device is attached to a heat generating component. The cylindrically shaped nut has an arc surface and two circular surfaces. A screw hole is formed on one of the two circular surfaces and an engraved slot is formed on the arc surface. The resilient bracket is secured to the heat dissipation device at an end and has a U-shaped cutout at an opposite end, wherein the U-shaped cutout has a constricted opening for receiving the cylindrically shaped nut. The U-shaped cutout engages with the engraved slot.
    Type: Application
    Filed: June 30, 2006
    Publication date: October 25, 2007
    Inventors: Chun-Fa Tseng, Chi-Hsueh Yang, Yu-Nien Hunng