Patents by Inventor Yu P. Gu

Yu P. Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of dynamically measuring thickness of a layer of a substrate
    Patent number: 7355394
    Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
    Type: Grant
    Filed: September 18, 2006
    Date of Patent: April 8, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu P. Gu, Joel Huston, Paul Smith, G. Lorimer Miller