Patents by Inventor Yu-Pei Chen
Yu-Pei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190163061Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.Type: ApplicationFiled: February 28, 2018Publication date: May 30, 2019Inventors: Chi-Shian CHEN, Bin-Ling TSAI, Yu-Pei CHEN, Chiao-Pei CHEN, Yu-Fu LIAO, Shih-Chang LIN, Chen-Ni CHEN, Tsung-Tai HUNG, Chiu-Feng CHEN
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Patent number: 9453513Abstract: An air blower is provided with an upper resonant chamber including an upper cover having an opening, an upper casing having an inlet engaging the opening, the upper casing secured to the upper cover to form a first chamber, first apertures through portions of the upper casing other than the inlet and communicating with the first chamber, and a first noise absorption material in the first chamber; a lower resonant chamber including a lower cover, a lower casing secured to the lower cover to form a second chamber, second apertures through the lower casing and communicating with the second chamber, and a second noise absorption material in the second chamber. The upper casing is on the lower casing to form a flow path. An impeller is in the flow path. In response to resonance, noise can be absorbed by the first and second absorption materials and converted into heat.Type: GrantFiled: March 25, 2014Date of Patent: September 27, 2016Inventor: Yu-Pei Chen
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Publication number: 20150292518Abstract: A centrifugal fan is provided with an electric motor; an impeller driven by the electric motor; and fan dampers around an inner surface of fan housing and surrounding the impeller. Each fan damper has a windward, concave surface facing a rotational direction of the impeller. A spiral airflow created by the impeller passes the windward curved portions of the fan dampers and the motor toward an outlet. A portion of the kinetic energy of the spiral airflow is transmitted axially and the remaining kinetic energy of the spiral airflow is converted into static pressure to convey the spiral airflow toward the outlet so as to converge the spiral airflow from the electric motor to the outlet, thereby causing most of the spiral airflow to flow axially when it reaches the outlet.Type: ApplicationFiled: April 11, 2014Publication date: October 15, 2015Inventor: Yu-Pei Chen
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Publication number: 20150275900Abstract: An air blower is provided with an upper resonant chamber including an upper cover having an opening, an upper casing having an inlet engaging the opening, the upper casing secured to the upper cover to form a first chamber, first apertures through portions of the upper casing other than the inlet and communicating with the first chamber, and a first noise absorption material in the first chamber; a lower resonant chamber including a lower cover, a lower casing secured to the lower cover to form a second chamber, second apertures through the lower casing and communicating with the second chamber, and a second noise absorption material in the second chamber. The upper casing is on the lower casing to form a flow path. An impeller is in the flow path. In response to resonance, noise can be absorbed by the first and second absorption materials and converted into heat.Type: ApplicationFiled: March 25, 2014Publication date: October 1, 2015Inventor: Yu-Pei Chen
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Patent number: 8778661Abstract: A biological composite and method for reducing H2S are disclosed. The biological composite for reducing H2S includes a carrier and Thermus sp. immobilized on the carrier. Therefore, if a sample containing H2S has contact with Thermus sp. or the carrier with Thermus sp. immobilized thereon, the amount of H2S can be reduced.Type: GrantFiled: March 12, 2012Date of Patent: July 15, 2014Assignee: National Chiao Tung UniversityInventors: Ching-Ping Tseng, Yu-Pei Chen
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Publication number: 20130115672Abstract: A biological composite and method for reducing H2S are disclosed. The biological composite for reducing H2S includes a carrier and Thermus sp. immobilized on the carrier. Therefore, if a sample containing H2S has contact with Thermus sp. or the carrier with Thermus sp. immobilized thereon, the amount of H2S can be reduced.Type: ApplicationFiled: March 12, 2012Publication date: May 9, 2013Applicant: National Chiao Tung UniversityInventors: Ching-Ping TSENG, Yu-Pei Chen
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Patent number: 6764872Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.Type: GrantFiled: September 27, 2002Date of Patent: July 20, 2004Assignee: Texas Instruments IncorporatedInventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
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Patent number: 6642593Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.Type: GrantFiled: December 19, 2000Date of Patent: November 4, 2003Assignee: Texas Instruments IncorporatedInventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
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Publication number: 20030075768Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.Type: ApplicationFiled: September 27, 2002Publication date: April 24, 2003Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
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Patent number: 6525396Abstract: The present invention provides an apparatus and method of selecting a unique combination of materials and dimensions for fabrication of a micro-electromechanical switch for improved RF switch performance. An electrode material is selected which exhibits a resistivity resulting in improved insertion loss for a predetermined switching speed, a dielectric material is selected which exhibits a permittivity resulting in improved isolation, and an airgap thickness is selected resulting in a pull-down voltage approximately equal to a supply voltage of the micro-electromechanical switch in which the isolation and predetermined switching speed are also functions of the airgap thickness.Type: GrantFiled: April 17, 2001Date of Patent: February 25, 2003Assignee: Texas Instruments IncorporatedInventors: Jose L. Melendez, Byron Williams, Yu-Pei Chen, Darius Crenshaw
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Publication number: 20020195681Abstract: The present invention provides an apparatus and method of selecting a unique combination of materials and dimensions for fabrication of a micro-electromechanical switch for improved RF switch performance. An electrode material is selected which exhibits a resistivity resulting in improved insertion loss for a predetermined switching speed, a dielectric material is selected which exhibits a permittivity resulting in improved isolation, and an airgap thickness is selected resulting in a pull-down voltage approximately equal to a supply voltage of the micro-electromechanical switch in which the isolation and predetermined switching speed are also functions of the airgap thickness.Type: ApplicationFiled: April 17, 2001Publication date: December 26, 2002Inventors: Jose L. Melendez, Byron Williams, Yu-Pei Chen, Darius Crenshaw
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Patent number: 6376787Abstract: A Micro Electro-Mechanical System (MEMS) switch (100) having a bottom electrode (116) formed over a substrate (112) and a thin protective cap layer (130) disposed over the bottom electrode (116). A dielectric material (118) is disposed over the protective cap layer (130) and a pull-down electrode (122) is formed over the spacer (120) and the dielectric material (118). The protective cap layer (130) prevents the oxidation of the bottom electrode (116). The thin protective cap layer (130) comprises a metal having an associated oxide with a high dielectric constant. A portion (132) of the thin protective cap layer (130) may oxidize during the formation of the dielectric material (118), increasing the capacitance of the dielectric stack (128).Type: GrantFiled: August 24, 2000Date of Patent: April 23, 2002Assignee: Texas Instruments IncorporatedInventors: Wallace W. Martin, Yu-Pei Chen, Byron Williams, Jose Melendez, Darius L. Crenshaw
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Publication number: 20010048141Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.Type: ApplicationFiled: December 19, 2000Publication date: December 6, 2001Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
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Patent number: D729377Type: GrantFiled: April 3, 2014Date of Patent: May 12, 2015Inventor: Yu-Pei Chen