Patents by Inventor Yu-Pei Chen

Yu-Pei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190163061
    Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.
    Type: Application
    Filed: February 28, 2018
    Publication date: May 30, 2019
    Inventors: Chi-Shian CHEN, Bin-Ling TSAI, Yu-Pei CHEN, Chiao-Pei CHEN, Yu-Fu LIAO, Shih-Chang LIN, Chen-Ni CHEN, Tsung-Tai HUNG, Chiu-Feng CHEN
  • Patent number: 9453513
    Abstract: An air blower is provided with an upper resonant chamber including an upper cover having an opening, an upper casing having an inlet engaging the opening, the upper casing secured to the upper cover to form a first chamber, first apertures through portions of the upper casing other than the inlet and communicating with the first chamber, and a first noise absorption material in the first chamber; a lower resonant chamber including a lower cover, a lower casing secured to the lower cover to form a second chamber, second apertures through the lower casing and communicating with the second chamber, and a second noise absorption material in the second chamber. The upper casing is on the lower casing to form a flow path. An impeller is in the flow path. In response to resonance, noise can be absorbed by the first and second absorption materials and converted into heat.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 27, 2016
    Inventor: Yu-Pei Chen
  • Publication number: 20150292518
    Abstract: A centrifugal fan is provided with an electric motor; an impeller driven by the electric motor; and fan dampers around an inner surface of fan housing and surrounding the impeller. Each fan damper has a windward, concave surface facing a rotational direction of the impeller. A spiral airflow created by the impeller passes the windward curved portions of the fan dampers and the motor toward an outlet. A portion of the kinetic energy of the spiral airflow is transmitted axially and the remaining kinetic energy of the spiral airflow is converted into static pressure to convey the spiral airflow toward the outlet so as to converge the spiral airflow from the electric motor to the outlet, thereby causing most of the spiral airflow to flow axially when it reaches the outlet.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 15, 2015
    Inventor: Yu-Pei Chen
  • Publication number: 20150275900
    Abstract: An air blower is provided with an upper resonant chamber including an upper cover having an opening, an upper casing having an inlet engaging the opening, the upper casing secured to the upper cover to form a first chamber, first apertures through portions of the upper casing other than the inlet and communicating with the first chamber, and a first noise absorption material in the first chamber; a lower resonant chamber including a lower cover, a lower casing secured to the lower cover to form a second chamber, second apertures through the lower casing and communicating with the second chamber, and a second noise absorption material in the second chamber. The upper casing is on the lower casing to form a flow path. An impeller is in the flow path. In response to resonance, noise can be absorbed by the first and second absorption materials and converted into heat.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 1, 2015
    Inventor: Yu-Pei Chen
  • Patent number: 8778661
    Abstract: A biological composite and method for reducing H2S are disclosed. The biological composite for reducing H2S includes a carrier and Thermus sp. immobilized on the carrier. Therefore, if a sample containing H2S has contact with Thermus sp. or the carrier with Thermus sp. immobilized thereon, the amount of H2S can be reduced.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: July 15, 2014
    Assignee: National Chiao Tung University
    Inventors: Ching-Ping Tseng, Yu-Pei Chen
  • Publication number: 20130115672
    Abstract: A biological composite and method for reducing H2S are disclosed. The biological composite for reducing H2S includes a carrier and Thermus sp. immobilized on the carrier. Therefore, if a sample containing H2S has contact with Thermus sp. or the carrier with Thermus sp. immobilized thereon, the amount of H2S can be reduced.
    Type: Application
    Filed: March 12, 2012
    Publication date: May 9, 2013
    Applicant: National Chiao Tung University
    Inventors: Ching-Ping TSENG, Yu-Pei Chen
  • Patent number: 6764872
    Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: July 20, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
  • Patent number: 6642593
    Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: November 4, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
  • Publication number: 20030075768
    Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 24, 2003
    Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
  • Patent number: 6525396
    Abstract: The present invention provides an apparatus and method of selecting a unique combination of materials and dimensions for fabrication of a micro-electromechanical switch for improved RF switch performance. An electrode material is selected which exhibits a resistivity resulting in improved insertion loss for a predetermined switching speed, a dielectric material is selected which exhibits a permittivity resulting in improved isolation, and an airgap thickness is selected resulting in a pull-down voltage approximately equal to a supply voltage of the micro-electromechanical switch in which the isolation and predetermined switching speed are also functions of the airgap thickness.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Jose L. Melendez, Byron Williams, Yu-Pei Chen, Darius Crenshaw
  • Publication number: 20020195681
    Abstract: The present invention provides an apparatus and method of selecting a unique combination of materials and dimensions for fabrication of a micro-electromechanical switch for improved RF switch performance. An electrode material is selected which exhibits a resistivity resulting in improved insertion loss for a predetermined switching speed, a dielectric material is selected which exhibits a permittivity resulting in improved isolation, and an airgap thickness is selected resulting in a pull-down voltage approximately equal to a supply voltage of the micro-electromechanical switch in which the isolation and predetermined switching speed are also functions of the airgap thickness.
    Type: Application
    Filed: April 17, 2001
    Publication date: December 26, 2002
    Inventors: Jose L. Melendez, Byron Williams, Yu-Pei Chen, Darius Crenshaw
  • Patent number: 6376787
    Abstract: A Micro Electro-Mechanical System (MEMS) switch (100) having a bottom electrode (116) formed over a substrate (112) and a thin protective cap layer (130) disposed over the bottom electrode (116). A dielectric material (118) is disposed over the protective cap layer (130) and a pull-down electrode (122) is formed over the spacer (120) and the dielectric material (118). The protective cap layer (130) prevents the oxidation of the bottom electrode (116). The thin protective cap layer (130) comprises a metal having an associated oxide with a high dielectric constant. A portion (132) of the thin protective cap layer (130) may oxidize during the formation of the dielectric material (118), increasing the capacitance of the dielectric stack (128).
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: April 23, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Wallace W. Martin, Yu-Pei Chen, Byron Williams, Jose Melendez, Darius L. Crenshaw
  • Publication number: 20010048141
    Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
    Type: Application
    Filed: December 19, 2000
    Publication date: December 6, 2001
    Inventors: Tsen-Hwang Lin, Yu-Pei Chen, Darius L. Crenshaw
  • Patent number: D729377
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: May 12, 2015
    Inventor: Yu-Pei Chen