Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal.

Abstract: The present invention provides a radio frequency identification (RFID) package structure for improving a low data reading rate of the conventional RFID transponder structure to overcome the disadvantage of the prior art, and packages a RFID die by an adhesive according to a package technology. The RFID package structure provides different ways of improving the data reading capability, such as adding a capacitor. The capacitance of the capacity can be adjusted to provide a RFID package structure applicable for different frequencies, or the RFID package structure formed by the structure of a single substrate together with the use of an adhesive can be used for producing the RFID package structure to lower the manufacturing cost.

Abstract: A radio wave soldering method provides instant heating for substrate of semiconductor device. The radio wave soldering method can heat a local portion of a substrate rapidly to 500-600° C. The method is suitable for substrate of semiconductor device with limit heat-resistance.