Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.

Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.

Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.

Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.

Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.

Abstract: The present disclosure provides a method for manufacturing a blind hole of an insulating substrate for an electronic device. The method includes following steps. A patterned photoresist layer is formed over the insulating substrate. The patterned photoresist layer has an opening exposing a portion of the insulating substrate. A wet etching process is performed to remove the exposed insulating substrate to form a blind hole in the opening.

Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.