Patents by Inventor Yu Ping Gu

Yu Ping Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10318898
    Abstract: Machine logic (for example, software) for determining a placement mode of at least one kind of objects in a multiplicity of storage areas are disclosed. A placement method includes the following operations: determining attraction factors of the multiplicity of storage areas, an attraction factor of each storage area indicating a capability that the storage area attracts attention of a customer; determining a spatial elasticity factor of the at least one kind of objects, a spatial elasticity factor of each kind of objects indicating an impact of a change of the storage areas where the kind of objects are placed on an attention degree of the kind of objects; and determining the placement mode of the objects in the multiplicity of storage areas, at least according to the attraction factors of the multiplicity of storage areas and the spatial elasticity factor of the at least one kind of objects.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: June 11, 2019
    Assignee: International Business Machines Corporation
    Inventors: Junlei Chen, Qun Tao Ding, Yu Ping Gu, Wei Huang, Jiu Jiang, Xue Ling Mi, Ji Min Zhang
  • Publication number: 20160055432
    Abstract: Machine logic (for example, software) for determining a placement mode of at least one kind of objects in a multiplicity of storage areas are disclosed. A placement method includes the following operations: determining attraction factors of the multiplicity of storage areas, an attraction factor of each storage area indicating a capability that the storage area attracts attention of a customer; determining a spatial elasticity factor of the at least one kind of objects, a spatial elasticity factor of each kind of objects indicating an impact of a change of the storage areas where the kind of objects are placed on an attention degree of the kind of objects; and determining the placement mode of the objects in the multiplicity of storage areas, at least according to the attraction factors of the multiplicity of storage areas and the spatial elasticity factor of the at least one kind of objects.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 25, 2016
    Inventors: Junlei Chen, Qun Tao Ding, Yu Ping Gu, Wei Huang, Jiu Jiang, Xue Ling Mi, Ji Min Zhang
  • Patent number: 7777483
    Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: August 17, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
  • Publication number: 20080186022
    Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
    Type: Application
    Filed: April 8, 2008
    Publication date: August 7, 2008
    Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
  • Patent number: 7112961
    Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: September 26, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
  • Publication number: 20040140797
    Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
    Type: Application
    Filed: October 14, 2003
    Publication date: July 22, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller