Patents by Inventor Yu-Ping Hsiao

Yu-Ping Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250151255
    Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Inventors: Yu-Ping HSIAO, Cheol-Soo PARK, Chun-Hung CHENG, Wei-Chieh CHUANG, Wei-Chao CHOU, Yen-Min JUAN
  • Patent number: 12232309
    Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: February 18, 2025
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Yu-Ping Hsiao, Cheol-Soo Park, Chun-Hung Cheng, Wei-Chieh Chuang, Wei-Chao Chou, Yen-Min Juan
  • Publication number: 20220415891
    Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.
    Type: Application
    Filed: February 4, 2022
    Publication date: December 29, 2022
    Inventors: Yu-Ping HSIAO, Cheol-Soo PARK, Chun-Hung CHENG, Wei-Chieh CHUANG, Wei-Chao CHOU, Yen-Min JUAN
  • Patent number: 11251262
    Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a cup-shaped lower electrode, a capacitive dielectric layer, an upper electrode, and a support layer. The support layer includes an upper support layer surrounding an upper portion of the cup-shaped lower electrode, a middle support layer surrounding a middle portion of the cup-shaped lower electrode, and a lower support layer surrounding a lower portion of the cup-shaped lower electrode. Surfaces of the upper support layer, the middle support layer, and the lower support layer are covered by the capacitive dielectric layer.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 15, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Ping Hsiao, Wei-Chao Chou, Ming-Tang Chen, Cheol Soo Park
  • Publication number: 20210151554
    Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a cup-shaped lower electrode, a capacitive dielectric layer, an upper electrode, and a support layer. The support layer includes an upper support layer surrounding an upper portion of the cup-shaped lower electrode, a middle support layer surrounding a middle portion of the cup-shaped lower electrode, and a lower support layer surrounding a lower portion of the cup-shaped lower electrode. Surfaces of the upper support layer, the middle support layer, and the lower support layer are covered by the capacitive dielectric layer.
    Type: Application
    Filed: September 25, 2020
    Publication date: May 20, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Yu-Ping Hsiao, Wei-Chao Chou, Ming-Tang Chen, CHEOL SOO PARK