Patents by Inventor Yu-Ping Tsai

Yu-Ping Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130141
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240097888
    Abstract: In a file sharing system, a key manager unit realizes a correspondence between the first user identifier and the first public key in response to a registration request of the first user, generates a first key material for encrypting the first file into a first encrypted file, and generates a first credential according to the first user identifier, the first file identifier, the first public key and the first key material after receiving an access-right claim request to the first file from the first user. A file storage unit stores the first encrypted file and the first credential. The first user uses the first user identifier, the first file identifier and the first private key to retrieve the first key material out of the first credential, and uses the first key material to decrypt the first encrypted file into the first file.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Inventors: CHIA-JUNG LIANG, CHIHHUNG LIN, CHIH-PING HSIAO, YU-JIE SU, CHIA-HSIN CHENG, TUN-HOU WANG, MENG-CHAO TSAI, YUEH-CHIN LIN
  • Publication number: 20240074209
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 11804461
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 31, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
  • Publication number: 20210407951
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Ping TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • Publication number: 20150378094
    Abstract: An optical fiber with image enhancement is provided with, in combination an elongated optical fiber unit including an image input surface on a bottom, an image output surface on a top, and a light guide member between the image input surface and the image output surface. The elongated optical fiber unit is a triangular sectional structure having a vertical surface and an inclined surface, and length of the image output surface is greater than that of the image input surface. The elongated optical fiber unit is configured to seamlessly fasten in a joining portion of two rectangular panels so that light is configured to pass through the image input surface, the light guide member, and the image output surface.
    Type: Application
    Filed: September 2, 2015
    Publication date: December 31, 2015
    Applicant: TAIWAN FIBER OPTICS, INC.
    Inventors: LUKE LU, YU-PING TSAI
  • Publication number: 20150043876
    Abstract: An optical fiber with image enhancement is provided with, in combination an elongated optical fiber unit including an image input surface on a bottom, an image output surface on a top, and a light guide member between the image input surface and the image output surface. The elongated optical fiber unit is a triangular sectional structure having a vertical surface and an inclined surface, and length of the image output surface is greater than that of the image input surface. The elongated optical fiber unit is configured to seamlessly fasten in a joining portion of two rectangular panels so that light is configured to pass through the image input surface, the light guide member, and the image output surface.
    Type: Application
    Filed: July 2, 2014
    Publication date: February 12, 2015
    Inventors: LUKE LU, YU-PING TSAI
  • Patent number: 7850478
    Abstract: A power supply has an outer shell and a retention bar. The outer shell has a rear panel and a cover. The rear panel has a socket and two guide slots. The cover has two pivot slots and two pivot mounts. Each pivot slot is formed through the cover adjacent to a corresponding guide slot. The pivot mounts are formed from and protrudes inwardly from the cover and have pivot holes formed therethrough. The retention bar is mounted in the pivot holes of the pivot mounts and has a clip and two protrusions. Therefore, when the power supply is mounted in a casing of a machine, the retention bar simultaneously fastens the power supply to the casing and a plug to the power supply.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: December 14, 2010
    Assignee: Acbel Polytech Inc.
    Inventors: Tien-Wen Lin, Yu-Ping Tsai, Kuo-Chu Yeh
  • Publication number: 20100105232
    Abstract: A power supply has an outer shell and a retention bar. The outer shell has a rear panel and a cover. The rear panel has a socket and two guide slots. The cover has two pivot slots and two pivot mounts. Each pivot slot is formed through the cover adjacent to a corresponding guide slot. The pivot mounts are formed from and protrudes inwardly from the cover and have pivot holes formed therethrough. The retention bar is mounted in the pivot holes of the pivot mounts and has a clip and two protrusions. Therefore, when the power supply is mounted in a casing of a machine, the retention bar simultaneously fastens the power supply to the casing and a plug to the power supply.
    Type: Application
    Filed: July 15, 2009
    Publication date: April 29, 2010
    Applicant: ACBEL POLYTECH.
    Inventors: Tien-Wen Lin, Yu-Ping Tsai, Kuo-Chu Yeh
  • Patent number: 7572836
    Abstract: This invention relates to the preparation of a copolymer which is used as a dispersing agent for titanate-based ceramic colloids. This copolymer has the following structure: Wherein R1 is H, NH4, alkali metals; R2 is H, NH4, alkali metals; R3 is H, NH4, alkali metals; a is an integer from 1 to 2000; b is an integer from 1 to 5000; and c is an integer from 1 to 1000; n is an integer from 1 to 500.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: August 11, 2009
    Assignee: National Taiwan Normal University
    Inventors: Kung-Chung Hsu, Chih-Hao Chen, Yu-Ping Tsai, Wen-Cheng Wei
  • Publication number: 20070060657
    Abstract: This invention relates to the preparation of a copolymer which is used as a dispersing agent for titanate-based ceramic colloids. This copolymer has the following structure: Wherein R1 is H, NH4, alkali metals; R2 is H, NH4, alkali metals; R3 is H, NH4, alkali metals; a is an integer from 1 to 2000; b is an integer from 1 to 5000; and c is an integer from 1 to 1000; n is an integer from 1 to 500.
    Type: Application
    Filed: April 5, 2006
    Publication date: March 15, 2007
    Inventors: Kung-Chung Hsu, Chih-Hao Chen, Yu-Ping Tsai, Wen-Cheng Wei