Patents by Inventor Yu-Ren Chu

Yu-Ren Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11313401
    Abstract: The disclosure provides a bolt including a main body, a head portion and a thread portion. The main body has a central axis. The head portion connects the main body. The thread portion is connected to the main body and runs around the central axis. The thread portion has a bearing surface facing toward the head portion. The bearing surface is a continuous curved surface or has an inflection point. The bearing surface includes a concave curved surface, a convex curved surface and a flank surface. The concave curved surface connects the main body. The convex curved surface is located further away from the main body than the concave curved surface. One side of the convex curved surface connects the concave curved surface, and another side of the convex curved surface connects the flank surface.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 26, 2022
    Assignee: CHUN YU WORKS & CO., LTD.
    Inventors: Yu-Ren Chu, Chih-Lung Hsieh
  • Publication number: 20200224703
    Abstract: The disclosure provides a bolt including a main body, a head portion and a thread portion. The main body has a central axis. The head portion connects the main body. The thread portion is connected to the main body and runs around the central axis. The thread portion has a bearing surface facing toward the head portion. The bearing surface is a continuous curved surface or has an inflection point. The bearing surface includes a concave curved surface, a convex curved surface and a flank surface. The concave curved surface connects the main body. The convex curved surface is located further away from the main body than the concave curved surface. One side of the convex curved surface connects the concave curved surface, and another side of the convex curved surface connects the flank surface.
    Type: Application
    Filed: October 31, 2018
    Publication date: July 16, 2020
    Applicant: CHUN YU WORKS & CO., LTD.
    Inventors: Yu-Ren CHU, Chih-Lung HSIEH
  • Patent number: 9580814
    Abstract: A chemical conversion coating is provided. The chemical conversion coating is disposed on a surface of a magnesium alloy substrate. The chemical conversion coating includes a first protecting layer. The first protecting layer contains manganese, magnesium and oxygen, and a manganese content of the first protecting layer is between 10 at. % to 20 at. %.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: February 28, 2017
    Assignee: National Taiwan University
    Inventors: Shun-Yi Jian, Kao-Feng Lin, Yu-Ren Chu, Chao-Sung Lin
  • Publication number: 20150191826
    Abstract: A chemical conversion coating is provided. The chemical conversion coating is disposed on a surface of a magnesium alloy substrate. The chemical conversion coating includes a first protecting layer. The first protecting layer contains manganese, magnesium and oxygen, and a manganese content of the first protecting layer is between 10 at. % to 20 at. %.
    Type: Application
    Filed: March 5, 2014
    Publication date: July 9, 2015
    Applicant: National Taiwan University
    Inventors: Shun-Yi Jian, Kao-Feng Lin, Yu-Ren Chu, Chao-Sung Lin
  • Publication number: 20100295160
    Abstract: A quad flat package (QDP) structure having an exposed heat sink is provided. The QDP structure includes a leadframe, a chip, a heat sink, an insulating layer and a molding compound. The leadframe includes a die pad and multiple leads surrounding the die pad. The chip is disposed on the die pad and electrically connected to the die pad and the leads. The heat sink has a top surface, a bottom surface opposite thereto, and a side surface connected to the top and the bottom surfaces. The die pad is disposed in a central area of the top surface of the heat sink and electrically connected to the heat sink. The molding compound encapsulates the chip, the die pad, an inner lead portion of each lead and heat sink, and exposes the bottom surface of the heat sink and an outer lead portion of each lead.
    Type: Application
    Filed: February 10, 2010
    Publication date: November 25, 2010
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: CHUN-CHEN LIU, Yu-Ren Chu