Patents by Inventor Yu Rim Choi

Yu Rim Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133888
    Abstract: The present disclosure relates to a nanostructure for detecting viruses including an amphipathic polymer, and a diagnostic platform using the same, wherein the nanostructure is capable of specifically detecting viruses through silica-based nanoparticles with excellent stability and high dispersion and a biocompatible amphipathic polymer, such that it is possible to develop a diagnostic platform with high sensitivity through binding and agglomeration of the nanostructure and viruses and enable rapid and accurate diagnosis of a target virus.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 25, 2024
    Applicant: KNU-INDUSTRY COOPERATION FOUNDATION
    Inventors: HYUN OUK KIM, JAE WON CHOI, SO JIN SHIN, YU RIM AHN, HEE WON AN, MIN SE KIM, HAK SEON KIM
  • Publication number: 20240085786
    Abstract: The present invention relates to a naphthalimide sulfonate derivative, and a photoacid generator and a photoresist composition each comprising same and, more specifically, to a naphthalimide sulfonate derivative compound, and a photoacid generator and a photoresist composition each comprising same, wherein the compound has excellent absorbance for light of i-line (365 nm) wavelength, is greatly easy to prepare into a polymerizable composition due to very high solubility in an organic solvent, has good thermal stability, and shows a favorable acid generation rate.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 14, 2024
    Applicant: SAMYANG CORPORATION
    Inventors: Chun Rim OH, Dae Hyuk CHOI, Yu Na CHOI, Deuk Rak LEE, Ji Eun CHOI, Ki Tae KANG, Min Jung KIM, Won Jung LEE, Chi Wan LEE
  • Patent number: 10685929
    Abstract: A semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member including a first insulating layer disposed on the active surface of the semiconductor chip, a first redistribution layer disposed on the first insulating layer, first vias penetrating through the first insulating layer and electrically connecting the connection pads and the first redistribution layer to each other, and a first insulating film covering the first insulating layer and the first redistribution layer. The first insulating film includes a silicon based compound.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hwa Park, Ga Young Yoo, Sang Ah Kim, Yu Rim Choi