Abstract: An apparatus for electroplating which is applicable to the electroplating of workpiece is disclosed. The apparatus includes: an electroplating solution container, a target, an absorbent piece, and a power supply. All the electroplating solution, workpiece, absorbent piece, and target are placed inside the electroplating solution container with at least partial portions of each workpiece, absorbent piece and target submerged in the electroplating solution. The positive electrode of the power supply is electrically connected to the target while its negative electrode is electrically connected to the workpiece and absorbent piece simultaneously. When the power supply imposes a current through the circuit, the target releases metal ions into the electroplating solution and metal ions reduce and a metal coating is formed on the workpiece. In the meantime, carbocations in the electroplating solution are adsorbed on the absorbent piece.