Patents by Inventor Yu-Sheng Hung

Yu-Sheng Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method for fabricating the same
    Patent number: 10217716
    Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 26, 2019
    Assignee: MEDIATEK INC.
    Inventors: Ta-Jen Yu, Yu-Sheng Hung, Wen-Sung Hsu
  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20180076166
    Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.
    Type: Application
    Filed: June 30, 2017
    Publication date: March 15, 2018
    Inventors: Ta-Jen Yu, Yu-Sheng Hung, Wen-Sung Hsu