Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: In one aspect, the disclosure relates to methods and compositions for treatment of cancer cachexia. In a further aspect, the composition is a pharmaceutical composition comprising a class I/IIB HDAC inhibitor and an androgen. In a still further aspect, the method of treatment comprises administering a class I/IIB HDAC inhibitor and an androgen to a subject or patient who has been diagnosed as having cancer cachexia. In some aspects, the class I/IIB HDAC inhibitor is a compound known as AR-42.

Abstract: A semiconductor structure includes a first dielectric layer over a first conductive line and a second conductive line, a high resistance layer over a portion of the first dielectric layer, a second dielectric layer on the high resistance layer, a low-k dielectric layer over the second dielectric layer, a first conductive via extending through the low-k dielectric layer and the second dielectric layer, and a second conductive via extending through the low-k dielectric layer and the first dielectric layer to the first conductive line. The first conductive via extends into the high resistance layer.

Abstract: A spindle device is mountable with a tool holder, and includes a rotating spindle rotatably mounted to a spindle main body and extending axially to have an axial end surface. A contactless power transmission module is disposed on a flange end surface of the spindle main body and an outer peripheral wall of the rotating spindle for supplying power. An electrically connecting module includes two conductive units each disposed in the rotating spindle and electrically connected with the power transmission module. Each conductive unit has an electrically conductive post extending axially and exposed from the axial end surface for conducting the power to the tool holder.

Abstract: A spindle device is mountable with a tool holder, and includes a rotating spindle rotatably mounted to a spindle main body and extending axially to have an axial end surface. A contactless power transmission module is disposed on a flange end surface of the spindle main body and an outer peripheral wall of the rotating spindle for supplying power. An electrically connecting module includes two conductive units each disposed in the rotating spindle and electrically connected with the power transmission module. Each conductive unit has an electrically conductive post extending axially and exposed from the axial end surface for conducting the power to the tool holder.

Abstract: A bicycle wheel includes: a hub with a hub spindle and two ears disposed on the hub spindle, the hub spindle having an axial direction; a wheel frame having a connecting portion; and a plurality of spokes each having a connecting section and two support sections, wherein the connecting section of each of the spokes is inserted through the connecting portion and divided along the axial direction into a first side and a second side, one of the two support sections is connected to the first side and one of the ears, another of the two support sections is connected to the second side and another of the ears, and the two support sections are arranged along the axial direction.

Abstract: A medical inspection device. A housing includes a transparent plate. A circuit board is disposed in the housing. At least one light-emitting element is disposed on and electrically connected to the circuit board. The light-emitting element is opposite to the transparent plate. Light from the light-emitting element is output to the exterior of the housing through the transparent plate. An image sensor is disposed on and electrically connected to the circuit board. The image sensor is opposite to the transparent plate. An image in the exterior of the housing is received by the image sensor through the transparent plate and converted into an image signal thereby. A grip is detachably connected to the housing. A signal transmission line is detachably connected to the circuit board and fit in the grip and extends to the exterior of the grip, outputting the image signal.

Abstract: A medical inspection device. A housing includes a transparent plate and a first opening. A reflective layer is formed in the housing and opposes the transparent plate. The first opening is between the reflective layer and the transparent plate. A grip is connected to the first opening and extends in the exterior of the housing. An optical fiber bundle is connected to the first opening and disposed in the grip. The optical fiber bundle extends to the exterior of the grip and outputs light into the housing. The light is output to the exterior of the housing by reflection of the reflective layer and through the transparent plate. An image outside the housing is received by the optical fiber bundle through the transparent plate and by reflection of the reflective layer.

Abstract: A medical inspection device. A housing includes a transparent plate and a first opening. A reflective layer is formed in the housing and opposes the transparent plate. The first opening is between the reflective layer and the transparent plate. A grip is connected to the first opening and extends in the exterior of the housing. An optical fiber bundle is connected to the first opening and disposed in the grip. The optical fiber bundle extends to the exterior of the grip and outputs light into the housing. The light is output to the exterior of the housing by reflection of the reflective layer and through the transparent plate. An image outside the housing is received by the optical fiber bundle through the transparent plate and by reflection of the reflective layer.

Abstract: A medical inspection device. A housing includes a transparent plate. A circuit board is disposed in the housing. At least one light-emitting element is disposed on and electrically connected to the circuit board. The light-emitting element is opposite to the transparent plate. Light from the light-emitting element is output to the exterior of the housing through the transparent plate. An image sensor is disposed on and electrically connected to the circuit board. The image sensor is opposite to the transparent plate. An image in the exterior of the housing is received by the image sensor through the transparent plate and converted into an image signal thereby. A grip is detachably connected to the housing. A signal transmission line is detachably connected to the circuit board and fit in the grip and extends to the exterior of the grip, outputting the image signal.