Abstract: The purpose of the present invention is to obtain an insulation film with high reliability, the insulation film and a wiring line being not susceptible to the occurrence of a crack due to thermal stress difference between the insulation film for wiring insulation or a protective film and inorganic materials, namely a metal wiring line, an inorganic light emitting diode chip and a substrate.

Abstract: The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 ?m of the cured film is 0.1% to 79% inclusive.

Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

Abstract: A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).

Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

Abstract: A photosensitive resin composition which is excellent in chemical resistance and electrical insulation property and which can form a cured relief pattern having a cross-sectional shape of a forward taper after curing is provided. The present invention is a photosensitive resin composition, comprising an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B), wherein the (meth)acryl group-containing compound (B) comprises a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by the general Formula (1), which is a condensate of compounds having a structure represented by the general Formula (1) and at least one structure selected from the general Formula (2-1), the general Formula (2-2), and the general Formula (2-3), and the compound (B1) has a weight average molecular weight of 1,000 to 20,000.

Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2).

Abstract: A liquid crystal polyimide, containing: repeating units of formula (I) and having liquid crystallinity, wherein A1 and A2 are each independently a tetravalent residue of a tetracarboxylic acid, B1 is a residue of a bis(amino) polysiloxane of formula (II), and C1 is a residue of an organic diamine, wherein R1 to R6 are each independently a lower alkyl group, x is from 0 to 10, D1 is an alkylene group, y is 0 or 1, and Z1 is selected from the group consisting of —H, —CH3, CF3, —F, —CN and —NO2. In addition, a liquid crystal resin composition and a resin film for a semiconductor element containing the liquid crystal polyimide.

Abstract: A liquid crystal polyimide, containing: repeating units of formula (I) and having liquid crystallinity, wherein A1 and A2 are each independently a tetravalent residue of a tetracarboxylic acid, B1 is a residue of a bis(amino)polysiloxane of formula (II), and C1 is a residue of an organic diamine, wherein R1 to R6 are each independently a lower alkyl group, x is from 0 to 10, D1 is an alkylene group, y is 0 or 1, and Z1 is selected from the group consisting of —H, —CH3, CF3, —F, —CN and —NO2. In addition, a liquid crystal resin composition and a resin film for a semiconductor element containing the liquid crystal polyimide.