Abstract: There are provided a thermoplastic resin film suitable for forming a meltable bag for packaging a hot-melt adhesive, the thermoplastic resin film having a high melting rate and high bag breakage resistance because adhesion between thermoplastic resin films is suppressed when packaged hot-melt adhesives are stored in a stacked manner and thus the breakage of the meltable bags is suppressed when the meltable bags are peeled apart, a meltable bag formed of the thermoplastic resin film, and a packaged hot-melt adhesive. A thermoplastic resin film contains at least one resin selected from the group consisting of a polyethylene resin and an ethylene-based copolymer, wherein (1) the film has at least one embossed surface, and the at least one embossed surface has a ten point height of irregularities Rzjis of 10 to 200 ?m, (2) the film has a melting point of 60° C. to 120° C., and (3) an elastic modulus in a TD direction and an elastic modulus in an MD direction are both 15 MPa or more.

Abstract: The present invention provides hot melt adhesives. A hot melt adhesive according to the present invention contains a styrenic block copolymer (A) containing a styrene-butadiene-styrene block copolymer (A1); and at least one styrenic block copolymer (A4) selected from the group consisting of a styrene-butadiene-styrene block copolymer (A2) and a styrene-isoprene-styrene block copolymer (A3), wherein the styrenic block copolymer (A) contains a predetermined amount of the styrene-butadiene-styrene block copolymer (A1) relative to the total amount of the styrene-butadiene-styrene block copolymer (A1) and the styrenic block copolymer (A4); a tackifier (B); and a plasticizer (C), wherein the hot melt adhesive has a melt viscosity of 6000 mPa s or lower.