Patents by Inventor Yu Suen

Yu Suen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20240109769
    Abstract: A chip package includes a semiconductor substrate and a metal layer. The semiconductor substrate has an opening and a sidewall surrounding the opening, in which an upper portion of the sidewall is a concave surface. The semiconductor substrate is made of a material including silicon. The metal layer is located on the semiconductor substrate. The metal layer has plural through holes above the opening to define a MEMS (Microelectromechanical system) structure, in which the metal layer is made of a material including aluminum.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Wei-Luen SUEN, Jiun-Yen LAI, Hsing-Lung SHEN, Tsang-Yu LIU
  • Human circulating dendritic cell compositions and methods
    Publication number: 20030129166
    Abstract: In accordance with the present invention, provided is a method for producing human circulating dendritic cells (cirDC) for therapeutic use, by depleting a human blood leukocyte composition of B cells, T cells and monocytes. Also provided are compositions containing cirDC for therapeutic use.
    Type: Application
    Filed: September 9, 2002
    Publication date: July 10, 2003
    Applicant: Nexell Therapeutics, Inc.
    Inventors: Yu Suen, Fang-Yao Hou, James G. Bender