Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: An electrode assembly, a battery, a battery pack and a vehicle including the same are provided. In the electrode assembly, the uncoated portion of an electrode includes a segment region divided into a plurality of segments, and the segment region includes a plurality of segment groups separated by a group separation pitch along a winding direction. One end of the electrode assembly includes a plurality of segment alignments. In winding turns corresponding to the plurality of segment alignments, group separation pitches of segment groups disposed in a same winding turn are substantially identical, and separation pitches of the segment groups is greater in a winding turn of a region adjacent to the outer circumference of the electrode assembly than in a winding turn of a region adjacent to the core of the electrode assembly.

Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.

Abstract: Provided is a switched beam-forming apparatus which includes a beam-forming unit forming a plurality of beams using an array antenna, a beam selection adjusting unit measuring Quality of Service (QoS) values of each of a plurality of signals received through the plurality of beams, a beam selecting unit selecting at least two beams with high QoS from among the plurality of beams according to the results of the QoS measuring, and a beam combining unit combining the at least two beams selected by the beam selecting unit.

Abstract: A cap structure includes a capping body, for covering a container mouth of a container. The capping body includes a base layer, a plurality of protruding members disposed on the base layer, and a sidewall joined to a periphery of the base layer. A liner layer having coupling structures is locked with the protruding members. A space is formed between the base layer and the liner layer.

Abstract: Provided is a switched beam-forming apparatus which includes a beam-forming unit forming a plurality of beams using an array antenna, a beam selection adjusting unit measuring Quality of Service (QoS) values of each of a plurality of signals received through the plurality of beams, a beam selecting unit selecting at least two beams with high QoS from among the plurality of beams according to the results of the QoS measuring, and a beam combining unit combining the at least two beams selected by the beam selecting unit.

Abstract: Provided is a method of compensating for energy loss and eliminating inter-symbol interference (ISI) and inter-chip interference (ISI) in wireless signals, and a rake receiver for wireless LANs adopting the same. The rake receiver compensates for energy loss of a CCK signal transmitted in a multi-path wireless channel environment and eliminates ISI and ICI from the received CCK signal because a DFE structure per chip used for calculating ICI components, is connected in parallel with a DFE structure per symbol, thus eliminating ISI and ICI components.

Abstract: Provided is a method of compensating for energy loss and eliminating inter-symbol interference (ISI) and inter-chip interference (ISI) in wireless signals, and a rake receiver for wireless LANs adopting the same. The rake receiver compensates for energy loss of a CCK signal transmitted in a multi-path wireless channel environment and eliminates ISI and ICI from the received CCK signal because a DFE structure per chip used for calculating ICI components, is connected in parallel with a DFE structure per symbol, thus eliminating ISI and ICI components.

Abstract: A zero insertion force socket comprises a base and a cover movably mounted on the base. The base has a body portion from a front edge of which a head extends and two cutouts defined beside the head. A hole is defined in the head and in communicating with the two cutouts via a space defined below the bottom of the head. The cover has two sockets extending downward therefrom and movably received in the cutouts. A locking strip has two ends firmly retained in the sockets and an intermediate portion positioned in the space below the bottom of the head. A spring member is formed in the intermediate portion of the locking strip and movably received in the hole of the head of the base. A recess is defined at a bottom of the base for receiving the spring member when the spring member is deformed and moved together with the cover.

Abstract: A zero insertion force (ZIF) socket comprises a dielectric base defining a number of contact receiving passageways for receiving a number of contacts therein and forming a pair of platforms outwardly extending from opposite lateral edges thereof, a slidable cover defining a number of pin receiving passageways for receiving corresponding pins of an IC package therein, and a resilient retention member received in one of the platforms of the base for locking the cover with the base in position thereby ensuring excellent electrical connection between the IC package and the ZIF socket.