Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: A method for forming a bonded semiconductor structure is disclosed. A first device wafer having a first bonding layer and a first bonding pad exposed from the first bonding layer and a second device wafer having a second bonding layer and a second bonding pad exposed from the second bonding layer are provided. Following, a portion of the first bonding pad is removed until a sidewall of the first bonding layer is exposed, and a portion of the second bonding layer is removed to expose a sidewall of the second bonding pad. The first device wafer and the second device wafer are then bonded to form a dielectric bonding interface between the first bonding layer and the second bonding layer and a conductive bonding interface between the first bonding pad and the second bonding pad. The conductive bonding interface and the dielectric bonding interface comprise a step-height.

Abstract: A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.

Abstract: A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.

Abstract: A laser level generates an emitted laser beam and a cross laser beam plane. The laser level includes a frame, a pendulum pivotally mounted to the frame to rotate about two axes with respect to the frame in a manner such that the gravity center of the pendulum defines a plumb line along the gravity direction, a laser module provided in the pendulum to generate a laser beam that is transmitted along a transmission line in a direction perpendicular to the plumb line, a spectroscope provided in the pendulum along the transmission line of the laser beam to split the laser beam into a split beam and an emitted laser beam that is perpendicular to the split beam, and a cross lens provided along the transmission line of the split beam in the pendulum to transform the split beam into a cross laser beam plane.

Abstract: A laser beam generating device has an underframe and a laser main body. The underframe has a guide mechanism. The laser main body generates a laser beam or plane, and has a turning mechanism that rotates inside the guide channel, and travels along the guide mechanism, in a manner such that the laser beam or laser plane can be radiated in horizontal and vertical directions.