Patents by Inventor YU-SYUAN CHANG

YU-SYUAN CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
    Publication number: 20240170381
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chun-Hsien HUANG, Peng-Fu HSU, Yu-Syuan CAI, Min-Hsiu HUNG, Chen-Yuan KAO, Ken-Yu CHANG, Chun-I TSAI, Chia-Han LAI, Chih-Wei CHANG, Ming-Hsing TSAI
  • Interconnect structures including a fin structure and a metal cap
    Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Method for producing polymer latex particle coated with silver nanoparticles
    Patent number: 9777125
    Abstract: This invention is related to a method for producing polymer latex particle coated with silver nanoparticles. First, a polymer latex particle suspension is mixed with a silver nitrate solution in a weight ratio of 10:1 to 1:10 at 50° C. to 90° C. for 10 to 120 minutes to form a mixed solution. After the temperature of the mix solution is cooled to 50° C. to 85° C., a sodium citrate solution is added to react with the mixed solution for 10 to 240 minutes to form a polymer latex particle coated with silver nanoparticles, which has antibacterial activity.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: October 3, 2017
    Assignees: Nerd Skincare Inc., Chia-Fen Lee
    Inventors: Ying-Tung Chen, Chia-Fen Lee, Yu-Syuan Chang, Kuen-Lin Leu
  • METHOD FOR PRODUCING POLYMER LATEX PARTICLE COATED WITH SILVER NANOPARTICLES
    Publication number: 20170114191
    Abstract: This invention is related to a method for producing polymer latex particle coated with silver nanoparticles. First, a polymer latex particle suspension is mixed with a silver nitrate solution in a weight ratio of 10:1 to 1:10 at 50° C. to 90° C. for 10 to 120 minutes to form a mixed solution. After the temperature of the mix solution is cooled to 50° C. to 85° C., a sodium citrate solution is added to react with the mixed solution for 10 to 240 minutes to form a polymer latex particle coated with silver nanoparticles, which has antibacterial activity.
    Type: Application
    Filed: November 27, 2015
    Publication date: April 27, 2017
    Inventors: YING-TUNG CHEN, CHIA-FEN LEE, YU-SYUAN CHANG, KUEN-LIN LEU