Patents by Inventor Yu Tachikawa

Yu Tachikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230167336
    Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber, wherein the pressure-sensitive adhesive layer has a first surface and a second surface opposed to the first surface, and wherein a maximum value S1 of a detection intensity of the UV absorber by time-of-flight secondary ion mass spectrometry (TOF-SIMS) in a range of from the first surface to a depth of 1 ?m in a thickness direction and a detection intensity C of the UV absorber by the TOF-SIMS at a center point in the thickness direction of the pressure-sensitive adhesive layer satisfy a relationship: S1/C?1.1.
    Type: Application
    Filed: March 22, 2021
    Publication date: June 1, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Tomokazu TAKAHASHI, Satoshi HONDA
  • Publication number: 20230167337
    Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and/or a photopolymerization initiator, wherein the pressure-sensitive adhesive sheet has a transmittance of 60% or less for light having a wavelength of 355 nm, and wherein the pressure-sensitive adhesive layer is a layer having an indentation elastic modulus at 23° C. of 25 MPa after irradiation with UV light having an integrated light quantity of 300 mJ/cm2.
    Type: Application
    Filed: March 22, 2021
    Publication date: June 1, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Tomokazu TAKAHASHI, Satoshi HONDA
  • Publication number: 20230019125
    Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 ?m or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.
    Type: Application
    Filed: December 10, 2020
    Publication date: January 19, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Tomokazu TAKAHASHI, Satoshi HONDA
  • Publication number: 20220325143
    Abstract: A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a heat-expandable agent. In the second step, an energy ray (R) is irradiated from the pressure-sensitive adhesive layer (10)-side of the bonded product (100) toward the adherend (20). A transmittance of the energy ray (R) in the pressure-sensitive adhesive layer (10) is 60% or more. The pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.
    Type: Application
    Filed: March 19, 2020
    Publication date: October 13, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
  • Publication number: 20220280986
    Abstract: A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a gas generating agent. In the second step, a laser light (L) is irradiated to the pressure-sensitive adhesive layer (10)-side of the bonded product (100) to heat a part of the pressure-sensitive adhesive layer (10). A pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA |, Keisuke HIRANO, Kiichiro MATSUSHITA
  • Publication number: 20220025223
    Abstract: A pressure-sensitive adhesive composition contains an adhesive component and gas-generative particles dispersed in the adhesive component. When the gas-generative particles are subjected to particle size distribution measurement, in the particle size distribution of the gas-generative particles, a cumulative particle size (D90) where a cumulative value from the smallest particle size is 90% based on volume is 10.0 ?m or less.
    Type: Application
    Filed: December 9, 2019
    Publication date: January 27, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
  • Publication number: 20220017789
    Abstract: A pressure-sensitive adhesive composition includes a pressure-sensitive adhesive component and a gas generating particle dispersed in the pressure-sensitive adhesive component. A tensile elastic modulus at 25° C. of the pressure-sensitive adhesive composition is 5 MPa or less. A gas generation amount at which the gas generating particle is generated in the pressure-sensitive adhesive composition is 5 mL/g or more in terms of decane at 0° C. and 1013 hPa in a solid content of the pressure-sensitive adhesive composition.
    Type: Application
    Filed: November 12, 2019
    Publication date: January 20, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Keisuke HIRANO, Kiichiro MATSUSHITA
  • Patent number: 11090405
    Abstract: A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: August 17, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Eiji Toyoda, Ryoma Yoshioka, Naoya Sugimoto, Yu Tachikawa
  • Patent number: 10717904
    Abstract: An adhesive preparation containing bisoprolol includes a backing and a pressure-sensitive adhesive layer formed on one side of the backing. The pressure-sensitive adhesive layer contains a polymer prepared through copolymerization of monomer components including a hydroxyl group-containing monomer and an alkyl (meth)acrylate monomer (component (A)), a polymer prepared through copolymerization of monomer components including a methyl methacrylate monomer and a butyl methacrylate monomer (component (B)), and bisoprolol (component (C)).
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: July 21, 2020
    Assignee: TOA EIYO LTD.
    Inventors: Eriko Abe, Yu Tachikawa, Satoshi Ameyama, Naoko Urushihara, Jun Ishikura, Tetsuya Nakamura, Akira Yokouchi, Yoshitaka Inoue, Kazuhiro Aoyagi, Tomoya Tanaka, Naohiro Nishida, Kunihiro Minami
  • Publication number: 20190247534
    Abstract: A laminate patchable a living body includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.
    Type: Application
    Filed: August 10, 2017
    Publication date: August 15, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji TOYODA, Ryoma YOSHIOKA, Naoya SUGIMOTO, Yu TACHIKAWA
  • Publication number: 20180194977
    Abstract: An adhesive preparation containing bisoprolol includes a backing and a pressure-sensitive adhesive layer formed on one side of the backing. The pressure-sensitive adhesive layer contains a polymer prepared through copolymerization of monomer components including a hydroxyl group-containing monomer and an alkyl (meth)acrylate monomer (component (A)), a polymer prepared through copolymerization of monomer components including a methyl methacrylate monomer and a butyl methacrylate monomer (component (B)), and bisoprolol (component (C)).
    Type: Application
    Filed: June 17, 2016
    Publication date: July 12, 2018
    Applicant: TOA EIYO LTD.
    Inventors: Eriko ABE, Yu TACHIKAWA, Satoshi AMEYAMA, Naoko URUSHIHARA, Jun ISHIKURA, Tetsuya NAKAMURA, Akira YOKOUCHI, Yoshitaka INOUE, Kazuhiro AOYAGI, Tomoya TANAKA, Naohiro NISHIDA, Kunihiro MINAMI
  • Publication number: 20160367494
    Abstract: A patch preparation includes a support and a pressure-sensitive adhesive layer formed on one surface of the support. The pressure-sensitive adhesive layer includes: (A) a polymer prepared by copolymerizing monomer components including a hydroxyl group-containing monomer and an alkyl (meth)acrylate monomer; (B) a polymer prepared by copolymerizing monomer components including a methyl methacrylate monomer and a butyl methacrylate monomer; and (C) a basic drug, provided that bisoprolol and a salt thereof are excluded.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yu TACHIKAWA, Satoshi AMEYAMA, Eriko ABE, Tetsuya NAKAMURA, Naoko URUSHIHARA, Jun ISHIKURA, Kazuhiro AOYAGI, Yoshitaka INOUE, Akira YOKOUCHI, Tomoya TANAKA
  • Patent number: 8361493
    Abstract: The patch according to an embodiment of the present invention includes: a support; and a pressure-sensitive adhesive layer on at least one surface of the support, wherein: the pressure-sensitive adhesive layer contains an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide; a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 wt % to 90 wt % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 1 wt % to 20 wt %; and the monomer components are substantially free of a monomer having a carboxyl group.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 29, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishikura, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Ryo Hashino, Satoshi Ameyama, Hidetoshi Kuroda
  • Publication number: 20110124833
    Abstract: There is provided a medical pressure-sensitive adhesive composition including an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide, wherein: a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 weight % to 99.9 weight % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 0.1 weight % to 20 weight %; and the monomer components are substantially free of a monomer having a carboxyl group. The medical pressure-sensitive adhesive composition of the present invention is particularly suitable for applications such as medical patches and patch preparations.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHIKURA, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Masayuki Okamoto, Masahito Niwa
  • Publication number: 20110123598
    Abstract: The patch according to an embodiment of the present invention includes: a support; and a pressure-sensitive adhesive layer on at least one surface of the support, wherein: the pressure-sensitive adhesive layer contains an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide; a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 wt % to 90 wt % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 1 wt % to 20 wt %; and the monomer components are substantially free of a monomer having a carboxyl group.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHIKURA, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Ryo Hashino, Satoshi Ameyama, Hidetoshi Kuroda