Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.

Abstract: A quick-disassemble snapping device of a rivet gun has a front sleeve, a rear sleeve, a snapping assembly, and a retaining assembly. The front sleeve has multiple positioning recesses. The rear sleeve is coaxially connected with the front sleeve and has at least one mounting recess. The snapping assembly is mounted in the front sleeve and the rear sleeve. The retaining assembly has a locking ring. The locking ring is mounted around the rear sleeve and has at least one engaging tooth mounted through the at least one mounting recess of the rear sleeve and engaging in at least one of the positioning recesses of the front sleeve. The quick-disassemble snapping device can be used in a pneumatic, manual, or electric rivet gun and has a stable structure. No tool is needed for disassembling the snapping device and the snapping device can be easily disassembled to be cleaned.

Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.

Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Abstract: A barrel assembly for a rivet gun has a barrel, a piston, a rear plug, a fluid tube, a control valve tube and a spring. The barrel has a cavity. The piston is mounted slidably in the cavity and has a rivet ejection passageway. The rear plug is mounted on a rear end of the barrel and has an assembling hole and a sliding passageway. The fluid tube is mounted detachably in the rear end of a head of the piston. The control valve tube is detachably mounted on the rear end of the fluid tube and is mounted slidably in the sliding passageway. With the fluid tube and the control valve tube, the barrel assembly efficiently prevents the high pressure air from continuously leaking out after the pin pulling action is finished.

Abstract: The rivet gun has a barrel, a handle, an inflator, a piston assembly and at least one buffer device. The piston assembly has a piston rod and a piston head. The at least one buffer device is mounted in the piston head and has a housing, a valve stem and a buffer spring. The housing has an inserting hole and a side hole communicating with the inserting hole. The inserting hole has a valve opening. The valve stem is movably mounted in the valve opening. A valve part is formed on a lower end of the valve stem to selectively close the valve opening. The buffer spring is mounted around the valve stem. When the piston head moves upward, the buffer spring absorbs some momentum produced by the high pressure gas to mitigate shake caused by the high pressure gas directly hitting the piston head.

Abstract: A barrel assembly for a rivet gun has a tube body, a vising piston and a rear valve. The tube body has an assembling hole and a bypass hole. The vising piston is mounted slidably in the assembling hole of the tube body and has a piston head mounted slidably in the assembling hole of the tube body and having two O-rings mounted around the piston head at an interval, and a shaft formed on the piston head. The rear valve mounted on the rear opening of the assembling hole of the tube body. When the vi sing piston moves backward adjacent to the rear opening of the assembling hole of the tube body, the bypass hole of the tube body is located at the interval between the O-rings and is sealed by the 0-rings without consuming high pressure air from a pneumatic cylinder.

Abstract: The rivet gun has a barrel, a handle, an inflator, a piston assembly and at least one buffer device. The piston assembly has a piston rod and a piston head. The at least one buffer device is mounted in the piston head and has a housing, a valve stem and a buffer spring. The housing has an inserting hole and a side hole communicating with the inserting hole. The inserting hole has a valve opening. The valve stem is movably mounted in the valve opening. A valve part is formed on a lower end of the valve stem to selectively close the valve opening. The buffer spring is mounted around the valve stem. When the piston head moves upward, the buffer spring absorbs some momentum produced by the high pressure gas to mitigate shake caused by the high pressure gas directly hitting the piston head.

Abstract: A rivet gun has a barrel, a handle, an annular flange, a pneumatic cylinder and a piston assembly. The handle protrudes downward from the barrel. The annular flange protrudes radially from the bottom end of the handle and has a bottom surface and a rotational angle alignment slot defined eccentrically in the bottom surface. The pneumatic cylinder is mounted under the handle and the annular flange and has a body and a top cover mounted on a top opening of the body and having a rotational angle alignment element mounted eccentrically on a top of the top cover and detachably engaging the rotational angle alignment slot of the annular flange. The piston assembly is mounted in the pneumatic cylinder. The rotational angle alignment slot and the rotational angle alignment element are both at least partially exposed to be visually observed from an appearance of the fully assembled rivet gun.

Abstract: A heart pulse detector includes a light emitting diode for emitting a short pulse light toward body tissue and a photo sensor for receiving light signal modulated by blood pulse flow through body tissue. The output current of photo sensor is charging a capacitor during pulse light and is discharging the same capacitor during no pulse light for same period of pulse light. The ambient light signal is then cancelled out from the detected light signal. The light current signal is transferred to a voltage signal after sample and hold procession. Finally heart pulse signal is detected out from the voltage signal without the interference of ambient light.

Abstract: The present invention offers a daisy chain serial bus system. For bus construction, the slave device has a first data transmission port to transfer serial data with its upward connected device and a second data transmission port to transfer serial data with its downward connected device. The most upward slave device is connected to a master device. In each slave device, the input data from a first data transmission port is transferred to a data input gate in a second data transmission port. There is a control register in each slave device to control the data input gate of the second data transmission port. After the bus system has been started, only the slave device connected to the master device can receive the data from the master device, so that the master device can assign the first device address to the slave device connected to it, then, the master device can assign the second device address to the slave device next connected to the first slave device on the bus.

Abstract: The present invention offers a daisy chain serial bus system. For bus construction, the slave device has a first data transmission port to transfer serial data with its upward connected device and a second data transmission port to transfer serial data with its downward connected device. The most upward slave device is connected to a master device. In each slave device, the input data from a first data transmission port is transferred to a data input gate in a second data transmission port. There is a control register in each slave device to control the data input gate of the second data transmission port. After the bus system has been started, only the slave device connected to the master device can receive the data from the master device, so that the master device can assign the first device address to the slave device connected to it, then, the master device can assign the second device address to the slave device next connected to the first slave device on the bus.

Abstract: A gardening shears consists of a fixed jaw, a movable jaw fastened pivotally with the fixed jaw and provided with a blade opposite to the fixed jaw, a braking member fastened pivotally with the fixed jaw and provided with a slide slot in which a pivoting member is capable of moving back and forth so as to actuate the movable jaw, and two handles fastened respectively with the fixed jaw and the braking member. As one of the two handles is moved in the direction away from another one of the two handles, the pivoting member is caused to relocated in the slide slot of the braking member so as to bring about a desired change in the length of the arm of application to make the pruning job easier.

Abstract: A gardening shears is composed of a fixed jaw, a movable jaw fastened pivotally with the fixed jaw, a rocking arm fastened with the fixed jaw and provided with a locating slot, an actuating device linking the movable jaw with the rocking arm, and two handles fastened respectively with the movable jaw and the rocking arm.