Abstract: A hardware-based fan controller for controlling fan modules in a computer system having multiple computer nodes is disclosed. Each of the computer nodes has a service processor. The fan controller includes a slave module that receives fan speed commands from each of the service processors. A fan speed generator is coupled to the slave module and a subset of the fan modules. The fan speed generator receives fan speed commands from the slave module and fan speed outputs from the subset of fan modules. The fan speed generator is configured to output a speed command to each of the fan modules in the subset.

Abstract: A field-replaceable unit (FRU) identification circuit includes a reference voltage source, a reference resistor, a plurality of comparators, and a plurality of comparator input voltage sources. The reference voltage source provides a reference voltage. A first end of the reference resistor is electrically connected to the reference voltage source. Each comparator has two inputs and an output. A first input of each comparator is electrically connected to a second end of the reference resistor. The comparator input voltage sources each provide a comparator input voltage to the second input of one of the comparators. When an FRU is electrically connected to a circuit board where the FRU identification circuit is located, the outputs of the comparators are set to a distinct combination of logical values that uniquely identifies the FRU.

Abstract: A slot assembly configured for being inserted by a workpiece. The slot assembly comprises a holder body, a substrate, a push member and a heat spreader. The substrate and the holder body together form an accommodating space therebetween. The push member is movable between a released position and a pressed position. The push member is configured for being moved from the released position to the pressed position by being pushed by the workpiece. The heat spreader is movably disposed on the substrate and located in the accommodating space. The heat spreader has a thermal contact surface facing away from the substrate. The thermal contact surface is configured for being in thermal contact with the workpiece. When the push member is located at the pressed position, the heat spreader is located at a thermal contact position where the thermal contact surface is in thermal contact with the workpiece.