Abstract: Devices and methods are described for a contrast tray and framing devices for use with imagers. Some embodiments describe a contrast tray for use with an imager comprising one or more light diffusing layers configured to shift at least some of an imaging light and one or more light filtering layers configured to filter out at least some of the imaging light. Light diffusing and light filtering layers can be further configured to upconvert at least some of the diffused and/or non-filtered light. Contrast trays can be used to improve imaging of gels such as PAGE gels when using a green or blue-green light. Other embodiments of the disclosure describe a framing device that provides better illumination and lower background fluorescence for fluorescent gels, such as nucleic acid gels.

Abstract: Aspects concern a data storage system comprising a data storage for storing data comprising a plurality of data elements, wherein each data element is associated with a data storage table, a data storage access interface configured to receive a request for an access to a data element from a data access client wherein the request comprises a identifier of the storage location of the data element and an access controller configured to determine a data storage table with which the data element is associated from the identifier of the storage location, determine whether the data access client has access rights to the determined data storage table allowing the access to the data element and grant the data access client access to the data element if the data access client has access rights to the determined data storage table allowing the access to the data element.

Abstract: A system and method for local film stress calculation is disclosed. The method may include specifying a plurality of measurement points on a substrate, the substrate being configured to receive a film deposition; obtaining a local film thickness measurement for each measurement point; obtaining a local wafer shape parameter for each measurement point; and calculating a local film stress value for each measurement point based on the local film thickness measurement and the local wafer shape parameter for each corresponding measurement point. The method may further include specifying a plurality of estimation points on the substrate; obtaining a local wafer shape parameter for each estimation point; calculating an estimated local film thickness for each estimation point; and calculating a local film stress value for each estimation point based on the estimated local film thickness and the local wafer shape parameter for each corresponding estimation point.