Abstract: A resin composition includes: 100 parts by weight of a maleimide resin including 50 parts by weight to 100 parts by weight of a maleimide resin represented by Formula (1); 2 parts by weight to 30 parts by weight of a polymer, including a structural unit represented by Formula (2), a structural unit represented by Formula (5), a structural unit represented by Formula (3) and a structural unit represented by Formula (4), wherein the structural units represented by Formula (3) and Formula (4) are located between the structural unit represented by Formula (2) and the structural unit represented by Formula (5); and 0.5 parts by weight to 5 parts by weight of a silicon-containing compound; wherein n and R1 to R4 are defined in the specification. The invention also provides an article manufactured using the aforesaid resin composition.

Abstract: A method includes obtaining a set of wireless statistics of a wireless communication device and a set of hardware-related information of the wireless communication device. The method further includes determining a set of test results of a testbed system based on the set of wireless statistics and the set of hardware-related information by configuring the testbed system based on the set of wireless statistics and the set of hardware-related information. The method further includes updating a set of decision parameters of a wireless configuration decision model using a machine learning model based on the set of test results. The method further includes sending the updated set of decision parameters to the wireless communication device, wherein the wireless communication device configures a wireless configuration parameter based on an instance of the wireless configuration decision model configured with the updated set of decision parameters.

Abstract: A resin composition is provided, which comprises: 75 parts by weight of vinyl group-containing polyphenylene ether resin; 35 parts by weight to 60 parts by weight of an insoluble flame retardant; and 0.4 parts by weight to 5 parts by weight of a compound represented by the following formula (1): wherein R1, R2, R3 and n are defined in the specification. The present invention also provides an article manufactured using the aforesaid resin composition.

Abstract: A method includes obtaining a set of wireless statistics of a wireless communication device and a set of hardware-related information of the wireless communication device. The method further includes determining a set of test results of a testbed system based on the set of wireless statistics and the set of hardware-related information by configuring the testbed system based on the set of wireless statistics and the set of hardware-related information. The method further includes updating a set of decision parameters of a wireless configuration decision model using a machine learning model based on the set of test results. The method further includes sending the updated set of decision parameters to the wireless communication device, wherein the wireless communication device configures a wireless configuration parameter based on an instance of the wireless configuration decision model configured with the updated set of decision parameters.

Abstract: A resin composition is disclosed. The resin composition includes 100 parts by weight of maleimide resin represented by the formula (1); 1.5 parts by weight to 20 parts by weight of hydrogenated polybutadiene; and 10 parts by weight to 35 parts by weight of a vinylbenzyl-containing compound, wherein n is an average number of a repeating unit based on a number-average molecular weight, n is a numerical value ranging from 1 to 20, and each R1to R4 independently is H or C1-3 alkyl. The invention also provides an article manufactured using the aforesaid resin composition.

Abstract: A resin composition is provided, which comprises: 75 parts by weight of vinyl group-containing polyphenylene ether resin; 35 parts by weight to 60 parts by weight of an insoluble flame retardant; and 0.4 parts by weight to 5 parts by weight of a compound represented by the following formula (1): wherein R1, R2, R3 and n are defined in the specification. The present invention also provides an article manufactured using the aforesaid resin composition.

Abstract: A method includes obtaining a set of wireless statistics of a wireless communication device and a set of hardware-related information of the wireless communication device. The method further includes determining a set of test results of a testbed system based on the set of wireless statistics and the set of hardware-related information by configuring the testbed system based on the set of wireless statistics and the set of hardware-related information. The method further includes updating a set of decision parameters of a wireless configuration decision model using a machine learning model based on the set of test results. The method further includes sending the updated set of decision parameters to the wireless communication device, wherein the wireless communication device configures a wireless configuration parameter based on an instance of the wireless configuration decision model configured with the updated set of decision parameters.

Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.

Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.

Abstract: Disclosed are an epoxy resin composition and an article made therefrom, the epoxy resin composition comprising an epoxy resin and a co-hardener, wherein: relative to the epoxy resin having a total equivalent of epoxy group of 1, the co-hardener comprises: (A) an acid anhydride having a total equivalent of acid anhydride group of 0.044-0.183; (B) a polyester having a total equivalent of ester group of 0.120-0.550; (C) a first phenolic resin having an equivalent of hydroxyl group of 0.092-0.550; and (D) a second phenolic resin having an equivalent of hydroxyl group of 0.143-0.592; and a sum of equivalent of functional groups of the co-hardener is 0.84-1.11.

Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.

Abstract: A light-emitting housing is disclosed. The light-emitting housing includes a light-emitting module and a housing. The light-emitting module includes a light guide plate and at least one light-emitting unit. The light guide plate includes an upper surface, a lower surface, and a plurality of dot regions, the dot regions are located on the lower surface, and the at least one light-emitting unit provides a plurality of light beams incident to the light guide plate. The housing is disposed above the light-emitting module and located on the upper surface of the light guide plate, and the housing includes at least one transparent region. Some of the light beams emitted by the at least one light-emitting unit are reflected through the dot regions and penetrate the upper surface of the light guide plate and the at least one transparent region.

Abstract: The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 ?m and 10 ?m; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 ?m and 4 ?m; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.

Abstract: A light-emitting housing is disclosed. The light-emitting housing includes a light-emitting module and a housing. The light-emitting module includes a light guide plate and at least one light-emitting unit. The light guide plate includes an upper surface, a lower surface, and a plurality of dot regions, the dot regions are located on the lower surface, and the at least one light-emitting unit provides a plurality of light beams incident to the light guide plate. The housing is disposed above the light-emitting module and located on the upper surface of the light guide plate, and the housing includes at least one transparent region. Some of the light beams emitted by the at least one light-emitting unit are reflected through the dot regions and penetrate the upper surface of the light guide plate and the at least one transparent region.

Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Abstract: The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 ?m and 10 ?m; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 ?m and 4 ?m; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.