Abstract: A wafer fixing mechanism as disclosed includes a fixing ring, a plurality of fixing members and a plurality of elastic units, wherein each fixing member is respectively connected to the fixing ring through a connecting shaft. The fixing ring includes a containing area for containing a wafer, and the wafer in the containing area is fixed by the fixing members. The two ends of the elastic unit are respectively connected to the fixing ring and the fixing member. When the wafer pushes the fixing members, the fixing members will swing relative to the fixing ring to prevent the fixing members from damaging the wafer. In addition, when the fixing member swings relative to the fixing ring, the elastic unit is deformed, so that the restoring force of the elastic unit is applied to the wafer via the fixing member, thereby fixing the wafer on a support pedestal.

Abstract: An adaptive cooling control method used in an adaptive cooling control system includes a controller installed in a machining center, a temperature sensor installed in a main shaft unit of the machining center, a temperature acquisition device and a main shaft cooling system. A built-in macro program unit of the controller determines whether the temperature of the main shaft falls within a predefined temperature rise range, and if so, the current cooling control parameters are maintained. If the temperature of the main shaft exceeds the predefined temperature rise range, appropriate cooling control parameters are calculated and provided to the dmain shaft cooling system for an adaptive control.