Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.

Abstract: An exercise intensity assessing system includes a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser exercises. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database for being diagnosed and analyzed by a fitness instructor. The cloud database obtains a forecasted watt value corresponding to the physiological information, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.

Abstract: An intelligent exercise intensity assessing system includes an exercise testing machine, a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser operates the exercise testing machine. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database. The cloud database analyzes the physiological information to obtain a corresponding forecasted watt value, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A method for improving wireless network connection is provided. The method is used in a mobile node moving in an area and includes: respectively receiving spatial information broadcasted by a root node and fixed nodes in a plurality of cells constituting the area, wherein each of the fixed nodes is directly connected to the root node, or indirectly connected to the root node through one or more other fixed nodes; obtaining current leakage weight values of the mobile node that is directly connected to the root node and is indirectly connected to the root node through the fixed nodes according to the spatial information received in each of the cells; generating a connection leakage table according to the largest one among the current leakage weight values; and determining a target position of the area which the mobile node moves to according to the connection leakage table.

Abstract: A method for improving wireless network connection is provided. The method is used in a mobile node moving in an area and includes: respectively receiving spatial information broadcasted by a root node and fixed nodes in a plurality of cells constituting the area, wherein each of the fixed nodes is directly connected to the root node, or indirectly connected to the root node through one or more other fixed nodes; obtaining current leakage weight values of the mobile node that is directly connected to the root node and is indirectly connected to the root node through the fixed nodes according to the spatial information received in each of the cells; generating a connection leakage table according to the largest one among the current leakage weight values; and determining a target position of the area which the mobile node moves to according to the connection leakage table.

Abstract: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.

Abstract: A lead-frame-based semiconductor package and a lead frame thereof are proposed. The semiconductor package includes: the lead frame having at least one die pad and a plurality of leads around the die pad, wherein a plurality of grooves and runners are formed on a surface of the die pad, and each of the grooves is connected to an edge of the die pad by at least one of the runners; at least one chip mounted on the other surface of the die pad and electrically connected to the plurality of leads; and an encapsulant for encapsulating the chip, with the runners and grooves being exposed from the encapsulant. Thus, the flash problem in the prior art can be solved by means of the runners and grooves.

Abstract: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.