Abstract: An integrated circuit die with two material layers having metal nano-particles and the method of forming the same are provided. The integrated circuit die includes a device layer comprising a first transistor, a first interconnect structure on a first side of the device layer, a first material layer on the first interconnect structure, wherein the first material layer comprises first metal nano-particles, and a second material layer bonded to the first material layer, wherein the second material layer comprises second metal nano-particles, and wherein the first material layer and the second material layer share an interface.

Abstract: A semiconductor package includes a leadframe having a die pad and lead terminals along a perimeter of the die pad, and an IC die mounted on the die pad. The IC die includes I/O pads disposed on an active front surface of the IC die. The IC die includes a semiconductor substrate, a circuit block fabricated on the semiconductor substrate, and a through substrate via (TSV) extending through a thickness of the semiconductor substrate. Bond wires extend between the I/O pads and the lead terminals, respectively. A molding compound encapsulates the IC die, the bond wires, and the leadframe.

Abstract: A semiconductor structure includes a semiconductor fin protruding from a substrate and oriented lengthwise along a first direction, a dielectric fin disposed over the substrate and oriented lengthwise along a second direction perpendicular to the first direction, where the dielectric fin defines a sidewall of the semiconductor fin along the second direction and where the dielectric fin includes a first dielectric layer disposed over a second dielectric layer that differs from the first dielectric layer in composition, and a metal gate stack disposed over the semiconductor fin and oriented lengthwise along the second direction.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a first nitride-containing layer on a side of a carrier substrate, first semiconductor devices thermally coupled to the first nitride-containing layer, a first interconnect structure physically and electrically coupled to first sides of the first semiconductor devices, and a first metal-containing dielectric layer bonding the first nitride-containing layer to the first interconnect structure. A thermal conductivity of the first nitride-containing layer is greater than a thermal conductivity of the first metal-containing dielectric layer.

Abstract: Provided is a method of forming a semiconductor structure including: bonding a device wafer onto a carrier wafer; forming a support structure between an edge of the device wafer and an edge of the carrier wafer, wherein the support structure surrounds a device layer of the device wafer along a closed path; removing a substrate and a portion of a bonding dielectric layer of the device wafer from a backside of the device wafer to expose the support structures while the support structure is in place; and removing the support structure through an acid etchant.

Abstract: A carrier structure and methods of forming and using the same are described. In some embodiments, the method includes forming one or more devices over a substrate, forming a first interconnect structure over the one or more devices, and bonding the first interconnect structure to a carrier structure. The carrier structure includes a semiconductor substrate, a release layer, and a first dielectric layer, and the release layer includes a metal nitride. The method further includes flipping over the one or more devices so the carrier structure is located at a bottom, performing backside processes, flipping over the one or more devices so the carrier structure is located at a top, and exposing the carrier structure to IR lights. Portions of the release layer are separated from the first dielectric layer.

Abstract: A keyboard, video, mouse (KVM) switch implements a picture-in-picture (PIP) function to allow desktop images from multiple computers to be displayed on the user console monitor. The KVM switch switches a first one of the multiple computers to the user console in a manner. The KVM switch further establishes a desktop sharing and remote control relationship between the first computer and each of the other computers, so that the first computer acts as a client which can see the desktop of the other computers (servers) and control them. The desktop images of the other computers are displayed on the console monitor as windows, which can be moved and re-sized. Audio data from the other computer are also transmitted to the user console. The PIP function is primarily implemented in software and no special video processing hardware is required in the KVM switch.

Abstract: Embodiments of the present invention describe an interactive display system and method for using the same. In one embodiment, an interactive display system includes a KVM switch system and a display panel. The KVM switch system has an input port and a plurality of output ports. The output port is configured to be coupled to computer servers. The display panel is coupled to the input port of the KVM switch system. The display panel includes a first zone for displaying video information, a second zone comprising a keyboard, and a third zone comprising a plurality of buttons.

Abstract: A keyboard, video, mouse (KVM) switch implements a picture-in-picture (PIP) function to allow desktop images from multiple computers to be displayed on the user console monitor. The KVM switch switches a first one of the multiple computers to the user console in a manner. The KVM switch further establishes a desktop sharing and remote control relationship between the first computer and each of the other computers, so that the first computer acts as a client which can see the desktop of the other computers (servers) and control them. The desktop images of the other computers are displayed on the console monitor as windows, which can be moved and re-sized. Audio data from the other computer are also transmitted to the user console. The PIP function is primarily implemented in software and no special video processing hardware is required in the KVM switch.

Abstract: A method of transferring data among computers coupled to a switch device is described. The switch device is configured to switch an access between the computers. In this method, data is received from a first computer and transferred to each clipboard of the computers by the switch device by a first user command.