Abstract: A virtual reality system with an inspecting function of assembling and disassembling and an inspection method of assembling and disassembling based on virtual reality are presented. A learning-end acquires an inspection data and a teaching assembling-disassembling record being set with a plurality of checkpoints, plays the teaching assembling-disassembling record, modifies a learning assembling-disassembling status of a plurality of virtual objects based on user's operations for assembling or disassembling. The learning-end issues an assembling-disassembling error reminder when the learning assembling-disassembling status is inconsistent with a teaching assembling-disassembling status at any of the checkpoints.

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

Abstract: The present invention discloses a method for determining psychological stress. The method includes the steps of: acquiring physiological parameter data comprising a first physiological parameter and a second physiological parameter temporally corresponding to the first physiological parameter; determining a reliability in an estimation of the psychological stress of the physiological parameter data based on a degree of match between the physiological parameter data and a plurality of criteria, wherein the plurality of criteria are determined based on a first reference value of the first physiological parameter and a second reference value of the second physiological parameter; and determining an indicator of the psychological stress based on the physiological parameter data and the reliability in the estimation of the psychological stress of the physiological parameter data.

Abstract: The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

Abstract: A sequence detection device includes a decision-feedback equalizer (DFE), a combining circuit, a decision circuit, and a sequence detection circuit. The DFE processes a symbol decision signal to generate a first equalized signal. The combining circuit combines a data signal and the first equalized signal to generate a sample signal. The decision circuit performs hard decision upon the sample signal to generate the symbol decision signal. The sequence detection circuit performs sequence detection upon the data signal to generate and output a symbol sequence. Regarding the sequence detection, the sequence detection circuit selects branches for branch metric calculation according to at least the symbol decision signal.

Abstract: A polyphenylene ether resin modified with two amino functional groups, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the two amino functional groups has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: A polyphenylene ether resin modified with bismaleimide, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the bismaleimide has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: A polyphenylene ether resin modified with benzoxazine, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the benzoxazine has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier; forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.

Abstract: A fan casing for mounting of a fan includes a frame including four corner segments and four side segments that are arranged alternately with the corner segments, a seat disposed in the frame, and four support members extending radially and outwardly from the seat and connected respectively to the corner segments. Each support member includes a base connected to the seat and having a width reducing in a direction away from the seat, and a rib connected between the base and the corresponding corner segment. The bases are interconnected to surround the seat. Any two adjacent bases are interconnected to form an arc surface facing the corresponding side segment and adapted to absorb shock.

Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

Abstract: The present invention discloses a method for determining a maximum value of a heart activity parameter of a user performing a physical activity. Acquire first heart activity data in a first duration of the physical activity performed by the user. Acquire motion data in the first duration of the physical activity performed by the user. Calculate second heart activity data based on the motion data in the first duration of the physical activity performed by the user by a mathematical model and estimate the maximum value of the heart activity parameter of the user based on a comparison between the first heart activity data and the second heart activity data.

Abstract: The present invention discloses a method for determining a degree of response to a physical activity. Acquire a physical activity signal measured by a sensing unit in the physical activity. Determine first data of a first physical activity feature set based on the physical activity signal. Determine a recognition of the degree of response to the physical activity based on the first data of the first physical activity feature set by a mathematical model describing a relationship between the first physical activity feature set and the degree of response to a physical activity. A portion of a first mechanism of the mathematical model adopts at least one portion of a second mechanism of a first neural network model associated with the second physical activity feature set.

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.

Abstract: A signal isolation system includes an external device; and a signal isolation circuit, coupled to the external device, including a control circuit, configured to operate the signal isolation circuit in an input mode or an output mode according to a status of the external device; a digital input/output circuit, configured to input/output signal based on the input mode or the output mode determined by the control circuit; and an input/output port, coupled to the digital input/output circuit, configured to be an input port or an output port according to the input mode or the output mode determined by the control circuit.

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.