Patents by Inventor Yu-Ting LU
Yu-Ting LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950408Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.Type: GrantFiled: March 7, 2022Date of Patent: April 2, 2024Assignee: NANYA TECHNOLOGY CORPORATIONInventors: Chiang-Lin Shih, Hsueh-Han Lu, Yu-Ting Lin
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 11923337Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.Type: GrantFiled: August 29, 2019Date of Patent: March 5, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
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Publication number: 20240063163Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.Type: ApplicationFiled: October 31, 2023Publication date: February 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
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Patent number: 11804461Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.Type: GrantFiled: September 13, 2021Date of Patent: October 31, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
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Publication number: 20230138460Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).Type: ApplicationFiled: December 27, 2022Publication date: May 4, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
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Patent number: 11538787Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).Type: GrantFiled: October 30, 2020Date of Patent: December 27, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
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Publication number: 20220139872Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).Type: ApplicationFiled: October 30, 2020Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
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Publication number: 20210407951Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.Type: ApplicationFiled: September 13, 2021Publication date: December 30, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Ping TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
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Patent number: 11121111Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.Type: GrantFiled: September 9, 2019Date of Patent: September 14, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Pin Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
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Patent number: 11088057Abstract: A semiconductor package structure includes a wiring structure, a semiconductor module, a protection layer and a plurality of outer conductive vias. The wiring structure includes at least one dielectric layer and at least one redistribution layer. The semiconductor module is electrically connected to the wiring structure. The semiconductor module has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The protection layer covers the lateral surface of the semiconductor module and a surface of the wiring structure. The outer conductive vias surround the lateral surface of the semiconductor module, electrically connect to the wiring structure, and extend through a dielectric layer of the wiring structure and the protection layer.Type: GrantFiled: May 10, 2019Date of Patent: August 10, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Pin Tsai, Man-Wen Tseng, Yu-Ting Lu
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Publication number: 20210074664Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.Type: ApplicationFiled: September 9, 2019Publication date: March 11, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
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Patent number: 10879215Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.Type: GrantFiled: March 8, 2019Date of Patent: December 29, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Li-Hao Lyu, Chieh-Ju Tsai, Yu-Kai Lin, Wei-Ming Hsieh, Yu-Pin Tsai, Man-Wen Tseng, Yu-Ting Lu
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Publication number: 20200357730Abstract: A semiconductor package structure includes a wiring structure, a semiconductor module, a protection layer and a plurality of outer conductive vias. The wiring structure includes at least one dielectric layer and at least one redistribution layer. The semiconductor module is electrically connected to the wiring structure. The semiconductor module has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The protection layer covers the lateral surface of the semiconductor module and a surface of the wiring structure. The outer conductive vias surround the lateral surface of the semiconductor module, electrically connect to the wiring structure, and extend through a dielectric layer of the wiring structure and the protection layer.Type: ApplicationFiled: May 10, 2019Publication date: November 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU
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Patent number: 10792767Abstract: A laser preheating control method is applied to a laser preheating control device. When a cutter processes a workpiece along a process path, a laser source of the device is provided to output a laser beam to the workpiece for selectively forming a laser spot on the workpiece surface. And according to a movement direction of the cutter, a laser controller of the device is provided to form the laser spot only on a preheating region of the workpiece, where in front of the cutter in the process path, for preheating the workpiece in the preheating region. As a result, the laser spot will not repeatedly heat the workpiece behind the cutter in the process path, and the qualitative change of the workpiece caused by repeating heating is preventable.Type: GrantFiled: December 26, 2017Date of Patent: October 6, 2020Assignees: Metal Industries Research & Development Centre, Parfaite Tool Co., Ltd.Inventors: Yu-Ting Lu, Yu-Fu Lin, Jui-Teng Chen, Wen-Long Chang, Chih-Hung Chou
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Publication number: 20190206843Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Li-Hao LYU, Chieh-Ju TSAI, Yu-Kai LIN, Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU
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Publication number: 20190143457Abstract: A laser preheating control method is applied to a laser preheating control device. When a cutter processes a workpiece along a process path, a laser source of the device is provided to output a laser beam to the workpiece for selectively forming a laser spot on the workpiece surface. And according to a movement direction of the cutter, a laser controller of the device is provided to form the laser spot only on a preheating region of the workpiece, where in front of the cutter in the process path, for preheating the workpiece in the preheating region. As a result, the laser spot will not repeatedly heat the workpiece behind the cutter in the process path, and the qualitative change of the workpiece caused by repeating heating is preventable.Type: ApplicationFiled: December 26, 2017Publication date: May 16, 2019Inventors: Yu-Ting Lu, Yu-Fu Lin, Jui-Teng Chen, Wen-Long Chang, Chih-Hung Chou
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Patent number: 10269771Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.Type: GrantFiled: August 11, 2017Date of Patent: April 23, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Li-Hao Lyu, Chieh-Ju Tsai, Yu-Kai Lin, Wei-Ming Hsieh, Yu-Pin Tsai, Man-Wen Tseng, Yu-Ting Lu
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Publication number: 20180178322Abstract: A laser process device includes a processing machinery for processing a workpiece, a laser source for emitting a laser beam to the workpiece and a modulating lens group. The modulating lens group can selectively modulate the laser beam for laser processing the workpiece respectively, like pre-heating, forming process or post treatment, so the modulating lens group can improve process efficiency of the processing machinery.Type: ApplicationFiled: December 28, 2016Publication date: June 28, 2018Inventors: Yu-Ting Lu, Chao-Yung Yeh, Chiu-Feng Lin, Ying-Cheng Lu
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Publication number: 20180061727Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.Type: ApplicationFiled: August 11, 2017Publication date: March 1, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Li-Hao LYU, Chieh-Ju TSAI, Yu-Kai LIN, Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU