Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A structure with a photodiode, an HEMT and an SAW device includes a photodiode and an HEMT. The photodiode includes a first electrode and a second electrode. The first electrode contacts a P-type III-V semiconductor layer. The second electrode contacts an N-type III-V semiconductor layer. The HEMT includes a P-type gate disposed on an active layer. A gate electrode is disposed on the P-type gate. Two source/drain electrodes are respectively disposed at two sides of the P-type gate. Schottky contact is between the first electrode and the P-type III-V semiconductor layer, and between the gate electrode and the P-type gate. Ohmic contact is between the second electrode and the first N-type III-V semiconductor layer, and between one of the two source/drain electrodes and the active layer and between the other one of two source/drain electrodes and the active layer.

Abstract: A light source device includes a light emitting element and a fluorescent portion. The light emitting element is configured to emit light. The fluorescent portion is disposed on the light emitting element. The fluorescent portion is configured to transform the light into illumination light. In the spectrum of the illuminating light, the energy in red band is in a range from 25% to 45% of the energy in full band.

Abstract: A planar transformer is configured on a multi-layer circuit board of a resonant converter. The planar transformer includes multiple layers of primary-side traces, multiple layers of secondary-side traces, and an iron core. The primary-side traces serve as a primary-side coil of the transformer to generate a first direction magnetic flux when the resonant converter operates. The secondary-side traces serve as a secondary-side coil of the transformer to generate a second direction magnetic flux when the resonant converter operates. The primary-side traces and the secondary-side traces surround a first core pillar and the second core pillar, and the primary-side traces and the secondary-side traces are configured in a specific stacked structure on the multi-layer circuit board, so that a magnetomotive force of the planar transformer can maintain balance during the operation of the resonant converter.

Abstract: A smoke detector with an anti-insect function includes a substrate, an optical detection module, a top cover, a base and a perforated plate. The substrate has a ring shape region surrounding a central detection region, and a first block structure of the central detection region is protruded from the substrate and higher than an upper surface of the ring shape region. The optical detection module is disposed inside the central detection region. The top cover has a lateral wall. The base is disposed on the substrate and connected to the top cover to cover the optical detection module. The base has a second block structure partly overlapped with the lateral wall to form a guiding channel. The perforated plate is disposed between the lateral wall and the second block structure to prevent an insect from moving into the top cover through the guiding channel.

Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.

Abstract: The present disclosure provides a dual-lens movement control method, which includes steps as follows. The tracking target is detected through the wide-angle lens, and the final tracking range is calculated; the magnification and the position are determined according to the final tracking range; the separate mode or the alignment mode is determined according to the magnification and the position.

Abstract: A semiconductor device includes a channel structure, a dielectric structure, a gate structure, a first conductive structure, and a second conductive structure. The channel structure has a top surface, a bottom surface, and a sidewall extending from the top surface to the bottom surface. The first conductive structure is disposed on the bottom surface of the channel structure and includes a body portion and at least one convex portion, and a top surface of the convex portion is higher than a top surface of the body portion. The second conductive structure is disposed on the top surface of the channel structure and includes a body portion and at least one convex portion, and a bottom surface of the body portion is higher than a bottom surface of the convex portion.

Abstract: A data processing method based on Trojan circuit detection includes controlling a processor, in a testing stage, to perform following steps: obtaining a plurality of characteristic values corresponding to a logic gate circuit; performing a distribution adjustment operation on the characteristic values to generate a plurality of adjusted characteristic values; and performing classification on the adjusted characteristic values to generate a logic identification result.

Abstract: A public transport vehicle charging system is applied to multiple charging stations and an electric vehicle. The public transport vehicle charging system includes a server communicatively connected to the charging stations and the electric vehicle. The server is configured to establish a charging decision model according to multiple historical conditions and a transport schedule. The server is configured to calculate multiple ideal decisions according to the historical conditions and the transport schedule, so as to adjust multiple parameters in the charging decision model. When the electric vehicle drives toward a first charging station according to the transport schedule, the server is configured to input a current condition into the charging decision model, so as to selectively charge the electric vehicle by the first charging station. The current condition includes a current remaining power and a current position of the electric vehicle.

Abstract: A composite intermediary device using vertical probe for wafer testing, comprising: a printed circuit board, a glass interposer and a vertical probe set; wherein the printed circuit board has printed circuit connected with a measuring apparatus, the glass interposer has multiple contact pads connected with the printed circuit, and then the probes of the vertical probe set are against the contact pads of the glass interposer and the bumps of the device under test. By a fine pitch configuration of the printed circuit and the contact pads of the glass interposer, the present invention achieves the requirements of synchronous and interleaved testing of multiple ICs.

Abstract: One wireless sensing method includes: generating a measurement request frame, wherein the measurement request frame is configured to carry indication information for phase report from a sensing responder, and sending the measurement request frame to the sensing responder. Another wireless sensing method includes: generating a measurement report frame, wherein the measurement report frame is configured to carry phase information, and sending the measurement report frame to a sensing initiator.

Abstract: A method for training a model for face recognition is provided. The method forward trains a training batch of samples to form a face recognition model w(t), and calculates sample weights for the batch. The method obtains a training batch gradient with respect to model weights thereof and updates, using the gradient, the model w(t) to a face recognition model what(t). The method forwards a validation batch of samples to the face recognition model what(t). The method obtains a validation batch gradient, and updates, using the validation batch gradient and what(t), a sample-level importance weight of samples in the training batch to obtain an updated sample-level importance weight. The method obtains a training batch upgraded gradient based on the updated sample-level importance weight of the training batch samples, and updates, using the upgraded gradient, the model w(t) to a trained model w(t+1) corresponding to a next iteration.

Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a semiconductor substrate having an active region, forming a fin structure in the active region, and forming a conductive element on the body portion and the first tapered portion of the fin structure. The fin structure includes a body portion, and a first tapered portion protruding from an upper surface of the body portion.

Abstract: The disclosure provides a bicycle caliper control method. The bicycle caliper control method is configured to control a rear caliper and a front caliper of a bicycle. The bicycle caliper control method includes: when a first brake lever of the bicycle is squeezed, the first brake lever activates the rear caliper and the front caliper; and when a second brake lever of the bicycle is squeezed, the second brake lever activates the rear caliper.

Abstract: A water quality detection device including a detection tank, a sensor, the cleaner and a processor is provided. The sensor is disposed on the detection tank and is configured to sense a to-be-detected liquid within the detection tank. The cleaner is configured to clean the sensor. The processor is electrically connected to the sensor and the cleaner and is configured to: execute an initialization procedure, which includes driving the sensor to sense the to-be-detected liquid to obtain a number of initial sensing values and calculating a threshold value according to the initial sensing values; drive the sensor to sense the to-be-detected liquid to obtain a sensing value of the to-be-detected liquid, and determine whether the sensing value of the to-be-detected liquid reaches the threshold value; drive the cleaner to operate when the sensing value of the to-be-detected liquid reaches the threshold value.

Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.

Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.

Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.