Patents by Inventor Yu-Tsai Wang

Yu-Tsai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140377503
    Abstract: A method for making a fiber board includes the steps of, providing a fiber sheet and positioning the fiber sheet in a mold, providing at least one plastic sheet and locating the plastic sheet on a surface of the fiber sheet. Heating and melting the plastic sheet to make the molten plastic penetrate into the fiber sheet, and hot pressing the fiber sheet and the molten plastic to form the fiber board. A fiber board made by the method is also described.
    Type: Application
    Filed: October 22, 2013
    Publication date: December 25, 2014
    Applicants: FIH (Hong Kong) Limited, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: YU-TSAI WANG, WU LI, DA-QING HUANG, XUAN-ZHAN ZENG, ZHI-WEI HU, JIE CUI, QIANG ZHANG
  • Patent number: 7326870
    Abstract: A key module and its manufacturing method are provided in the present invention. The steps of the method include: providing a mold; forming a key body having multiple opening portions on the mold; jostling a combination of a display body and an elastic body to the key body; and finally, tightly attaching the display body to the key body and stuffing the display body into the opening portions of the key body. Therein, the elastic body has a lower end formed with a contact block contacting a circuit board. By compressing, injecting or infusing a silicone rubber material or an elastic material into the opening portions, the gap located between the key body and the display body or between the key body and the elastic body is smaller than 0.01 mm. Thus, the appearance of the key module of the present invention is almost seamless.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: February 5, 2008
    Assignee: Silitech Technology Corp.
    Inventors: Chun-Wei Lin, Yu-Tsai Wang, Yu-Yen Lien
  • Publication number: 20070029182
    Abstract: A key module and its manufacturing method are provided in the present invention. The steps of the method include: providing a mold; forming a key body having multiple opening portions on the mold; jostling a combination of a display body and an elastic body to the key body; and finally, tightly attaching the display body to the key body and stuffing the display body into the opening portions of the key body. Therein, the elastic body has a lower end formed with a contact block contacting a circuit board. By compressing, injecting or infusing a silicone rubber material or an elastic material into the opening portions, the gap located between the key body and the display body or between the key body and the elastic body is smaller than 0.01 mm. Thus, the appearance of the key module of the present invention is almost seamless.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 8, 2007
    Inventors: Chun-Wei Lin, Yu-Tsai Wang, Yu-Yen Lien