Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

Abstract: A system stores parameters of a feature extraction network and a refinement network. The system receives an input including a degraded image concatenated with a degradation estimation of the degraded image; performs operations of the feature extraction network to apply pre-trained weights to the input to generate feature maps; and performs operations of the refinement network including a sequence of dynamic blocks. One or more of the dynamic blocks dynamically generates per-grid kernels to be applied to corresponding grids of an intermediate image output from a prior dynamic block in the sequence. Each per-grid kernel is generated based on the intermediate image and the feature maps.

Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

Abstract: A touch module includes a panel device, an outer frame, and an optical sensor. The panel device includes an array substrate and a display panel having a touch surface. The array substrate is electrically connected to the display panel. The outer frame is disposed on the panel device. The optical sensor is disposed between the panel device and the outer frame, including a wire, at least one lens, a photosensitive chip, and a reflection mirror. The wire is formed on the array substrate. The lens is disposed between the display panel and the outer frame for guiding light transmitted from the touch surface. The photosensitive chip is electrically connected to one end of the wire. The reflection mirror is disposed above the photosensitive chip for reflecting the light guided by the lens to the photosensitive chip.

Abstract: A microphone includes a housing, an acoustic port formed in the housing, a diaphragm disposed within the housing adjacent the acoustic port, a backplate assembly operably disposed within the housing in spaced relationship relative to the diaphragm and a circuit assembly disposed within the housing. A connecting member extends between the circuit assembly and the backplate assembly to secure mechanically the backplate assembly within the housing and to couple electrically the backplate assembly to the circuit assembly.