Patents by Inventor YU-TSENG LIN

YU-TSENG LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180169920
    Abstract: A molding structure comprising a first mold body, a second mold body suited for combining with the first mold body, a molding core, a first heating element, and a second heating element is provided. A mold cavity is formed between the first mold body and the second mold body when the first mold body and the second mold body are joined together. The molding core is disposed in the mold cavity, wherein the molding core comprises a body, an inner surface, and an outer surface. The first heating member is disposed through the body to heat the molding core. The second heating element is movably disposed on the outer surface of the molding core to preheat the molding core.
    Type: Application
    Filed: March 21, 2017
    Publication date: June 21, 2018
    Inventors: SHIA-CHUNG CHEN, YUNG-HSIANG CHANG, KUAN-HUA LEE, JEN-AN CHANG, YU-TSENG LIN