Abstract: A transducer includes: a substrate; and a plurality of transducer elements disposed on the substrate, and each transducer element including: a bottom electrode; an oscillatory element disposed on the bottom electrode and having an opening, wherein there is a cavity between the bottom electrode and the oscillatory element; a top electrode disposed on the oscillatory element, wherein the top electrode and the bottom electrode are overlapped in a top view direction; and a passivation layer disposed on the oscillatory element and the top electrode and in the opening of the oscillatory element, wherein the passivation layer extends continuously from a position on the oscillatory element to a position on the bottom electrode through the opening and the cavity.

Abstract: A sensing device is provided. The sensing device includes a sensing circuit, a plurality of sensing elements, and a plurality of light-collecting elements. The light-collecting elements are for collecting lights to the plurality of sensing elements. The plurality of sensing elements are configured to generate a plurality of sensing signals according to the lights that are collected, and output the plurality of sensing signals as a whole to the sensing circuit.

Abstract: A card device including a first substrate, a circuit board, a sensing unit and a protective layer is disclosed. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing unit is disposed in the accommodating recess and electrically connected to the circuit board. The protective layer is disposed on the circuit board, and the protective layer covers the circuit board and the sensing unit.

Abstract: The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.

Abstract: A sensing substrate is provided. The sensing substrate includes a first substrate, a circuit layer, a planarization layer, a sensing unit and a first bonding layer. The circuit layer is disposed on the first substrate. The planarization layer is disposed on the circuit layer, and the planarization layer includes an opening. The sensing unit is disposed on the planarization layer, and the sensing unit is electrically connected to the circuit layer through the opening. The first bonding layer is disposed on the planarization layer.

Abstract: An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

Abstract: An optical sensing device including a substrate, a light-sensing element, a light-shielding layer, an insulating layer and a light-collecting element is disclosed. The light-sensing element is disposed on the substrate. The light-shielding layer is disposed on the light-sensing element and includes a first opening overlapping the light-sensing element. The insulating layer is disposed on the light-shielding layer and includes a second opening overlapping the first opening. The light-collecting element is disposed on the insulating layer and overlaps the second opening and includes a focus distance F and a first refractive index N1. A second refractive index N3 of an external medium, the first refractive index N1, the focus distance F, and a radius R? of curvature of the light-collecting element meet the following equation: N1/N3=F/(F?R?).

Abstract: A method for manufacturing an electronic device includes the following steps: providing a carrier and a circuit substrate, wherein the carrier includes a plurality of spacers, the circuit substrate includes a plurality of electronic units, and the electronic units are detected and determined to be normal or defective; providing cover units on the carrier; disposing the circuit substrate on the cover units so that the spacers support the circuit substrate, wherein there is a gap between the circuit substrate and the cover units, and the cover units correspond to the electronic units determined to be normal; vacuuming the gap between the circuit substrate and the cover units; moving the spacers to make the cover units and the circuit substrate contact each other; and pressing the cover units and the circuit substrate to fix the cover units and the circuit substrate to each other.

Abstract: A sensing device is provided, which comprises: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising a switch element; a reflector disposed on the circuit layer, the reflector comprising a first reflection part and a second reflection part separated from each other, wherein the first reflection part is electrically connected to the switch element, and the second reflection part receives a voltage; and a sensing element disposed on the reflector, the sensing element separated from the reflector by a gap, wherein the sensing element comprises a first absorbing part, a second absorbing part and a sensing part disposed on the first absorbing part and the second absorbing part; wherein in a normal direction of the sensing device, the first absorbing part and the second reflection part are not overlapped, and the second absorbing part and the first reflection part are not overlapped.

Abstract: A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.

Abstract: A sensing device includes a plurality of sensing sets having a plurality of lenses and a plurality of sensing units. The sensing units are configured to collect reflected light which pass through the lenses. Each sensing set adopts a structure which includes one sensing unit and multiple lenses for providing fingerprint sensing with high accuracy.

Abstract: A sensing device includes: a substrate, a circuit layer and a plurality of sensing units. The circuit layer is disposed on the substrate, and includes a plurality of driving circuits. The sensing unit is disposed on the circuit layer, and includes a supporting part and a sensing part. The supporting part is electrically connected to one of the driving circuits. The sensing part is electrically connected to the supporting part, and is separated from the circuit layer by a cavity through the supporting part. In a normal direction of the substrate, at least part of the supporting part overlaps with the sensing part.

Abstract: A sensing device includes: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens includes a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range.

Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 ?m and less than or equal to 10 ?m. An electronic device including the sensing device is also provided.

Abstract: An electronic device is provided. The electronic device includes a substrate, a first light-shielding layer, a second light-shielding layer, a third light-shielding layer and an optical sensing element. The first light-shielding layer is disposed on the substrate and has a first opening. The second light-shielding layer is disposed on the first light-shielding layer and has a second opening. The third light-shielding layer is disposed on the second light-shielding layer and has a third opening. The optical sensing element is disposed on the substrate, and overlapped with the first opening. In addition, in a top-view diagram, centers of the first opening, the second opening and the third opening are separated from each other along a first direction, and the first direction is a line connecting a center of the first opening and a center of the third opening.

Abstract: The electronic device includes a substrate; an active layer disposed above the first substrate; a first signal line disposed above the substrate and overlapped with the active layer; and a conductive pattern disposed above the substrate. The conductive pattern includes a first side extending in a first direction, a second side extending in the first direction, and a third side connected between the first side and the second side, and wherein the third side includes a part that the part is not parallel to the first direction and not perpendicular to the first direction, and the part is located out of the first signal line and overlapped with the active layer.

Abstract: An electronic device are provided. The electronic device includes a display panel and an optical sensing module. The optical sensing module is disposed on a side of the display panel and includes an optical sensing layer, an optical assembly, and a light-blocking element. The optical assembly is disposed between the optical sensing layer and the display panel. The light-blocking element overlaps a portion of the optical sensing layer in a normal direction of the optical sensing layer. The optical assembly includes a plurality of light-blocking layers, and at least a portion of the plurality of light-blocking layers have different-sized openings.

Abstract: The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.

Abstract: An electronic device having a sensing region and a non-sensing region includes a sensing element, a first light shielding layer and a second light shielding layer. The sensing element is disposed corresponding to the sensing region. The first light shielding layer includes at least one first opening corresponding to the sensing element. The second light shielding layer includes at least one second opening overlapped with the first opening. In a cross-section view, a boundary between the sensing region and the non-sensing region is at an outer side of an edge of a portion of the first light shielding layer, and a horizontal distance between an edge of a portion of the second light shielding layer and the sensing element is greater than or equal to a vertical distance between the portion of the second light shielding layer and the sensing element in a top-view direction of the electronic device.

Abstract: An electronic device is provided. The electronic device includes a substrate, an optical sensing element, a light-shielding structure, and a microlens. The substrate has a normal direction. The optical sensing element is disposed on the substrate. The light-shielding structure is disposed on the optical sensing element and includes a plurality of light-shielding layers. Each light-shielding layer includes an opening, and centers of the openings are arranged along a first direction and separated from each other. The microlens is disposed on the light-shielding layers and overlaps the opening of the uppermost light-shielding layer. The microlens guides light into an optical channel formed by the openings, so that the optical sensing element has a maximum response value for light with an incident angle that is greater than or equal to 10 degrees and less than or equal to 30 degrees relative to the normal direction.