Abstract: Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electrostatic discharge protection due to the sacrificial electrodes are broken.

Abstract: An integrated and monolithic package structure of acoustic wave device is provided that includes a first device, a conjunction layer, a second device and a conductive layer. The first device is placed in a way of face up, the second device is placed in a way of face down, and the conjunction layer is placed between the first device and second device so as to form the structure of acoustic wave device. Due to the fact that the conductive layer is formed at least on one side of the device thereof, the thermal effect and electromagnetic feed-through can be reduced. The encapsulation package technology, air cavity package technology, and a package of the multi-layer structure, including a space layer, a chip contact layer, and a circuit board, are provided to protect the acoustic device and the conductive layer at the lateral sides of the acoustic device from the destroying due to the humidity and the mechanical destroying coming from the external environment.

Abstract: A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the conventional arts can be avoided. Therefore, the present invention provides a packaging structure and method with a better hermeticity and a simpler process. Especially, due to the buffer layer, the planarization for flip-chip bonding can be improved and reduce negative effects of the packing process.