Patents by Inventor YU-WEI HSIAO

YU-WEI HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093701
    Abstract: A display device has a transmissive area and a reflective area. The transmissive area corresponds to a first sub-pixel, and the reflective area corresponds to a second sub-pixel. The display device includes a backlight module, a liquid crystal module, and an anti-reflective layer. The liquid crystal module is disposed on the backlight module and includes a first substrate, a component layer, and a reflective layer. The component layer is disposed on the first substrate and includes a first transistor and a second transistor. The first transistor is configured to drive the first sub-pixel, and the second transistor is configured to drive the second sub-pixel. The reflective layer is disposed on the component layer and corresponds to the reflective area. The anti-reflective layer is disposed on the liquid crystal module.
    Type: Application
    Filed: August 16, 2024
    Publication date: March 20, 2025
    Applicants: Innolux Corporation, CARUX TECHNOLOGY PTE. LTD.
    Inventors: Li-Wei Sung, Cheng-Jen Chu, Hong-Sheng Hsieh, Yu-Chih Tseng, Yu-Cheng Hsiao
  • Publication number: 20250087639
    Abstract: A method includes forming first integrated circuits on a front side of a semiconductor substrate of a first device die, forming a trench capacitor extending from a backside of the semiconductor substrate into the semiconductor substrate, and forming a first through-via and a second through-via penetrating through the semiconductor substrate. The trench capacitor is electrically coupled between the first through-via and the second through-via. A second device die is bonded to the first die. The second device die includes second integrated circuits, and power nodes of the second integrated circuits are electrically coupled to the first through-via and the second through-via.
    Type: Application
    Filed: January 2, 2024
    Publication date: March 13, 2025
    Inventors: Ke-Gang Wen, Yu-Bey Wu, Tsung-Chieh Hsiao, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20250087929
    Abstract: An elbow cable connector includes: a cable assembly comprising a head, an outer conductor extending forwards, an insulator received in the outer conductor, an inner conductor received in the insulator, a cable mechanically connected with the inner conductor and extending downwards, and a rear cover; and an outer shell surrounding the outer conductor, the head, and an upper end of the cable; wherein the head is of a die casting and has a fixing hole running forwards and a receiving groove opening rearwards and downwards, the outer conductor has a rear flange on a rear end thereof, the outer conductor goes across the fixing hole and the rear flange presses against a front face of the receiving groove, a rear part of the insulator and the upper end of the cable are received in the receiving groove, and the rear cover presses forward and seal the receiving groove.
    Type: Application
    Filed: September 13, 2024
    Publication date: March 13, 2025
    Inventors: Teng Huang, De-Jin Chen, He Chen, Shih-Wei Hsiao, Yu-San Hsiao
  • Publication number: 20250080756
    Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, one or more model parameters of one or more cross-color models for the second-color block are determined. Then, cross-color predictors for the second-color block are determined, wherein one cross-color predictor value for the second-color block is generated for each second-color pixel of the second-color block by applying said one or more cross-color models to corresponding reconstructed or predicted first-color pixels. The input data associated with the second-color block is encoded using prediction data comprising the cross-color predictors for the second-color block at the encoder side, or the input data associated with the second-color block is decoded using the prediction data comprising the cross-color predictors for the second-color block at the decoder side.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 6, 2025
    Inventors: Man-Shu CHIANG, Olena CHUBACH, Yu-Ling HSIAO, Chia-Ming TSAI, Chun-Chia CHEN, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250070064
    Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.
    Type: Application
    Filed: January 3, 2024
    Publication date: February 27, 2025
    Inventors: Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang, Hsin-Feng Chen, Tsung-Chieh Hsiao, Chih Chuan Su, Dian-Hau Chen
  • Patent number: 12237398
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: February 25, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Ming Kuo, Po-Jen Chuang, Yu-Ren Wang, Ying-Wei Yen, Fu-Jung Chuang, Ya-Yin Hsiao, Nan-Yuan Huang
  • Publication number: 20250063155
    Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, input data associated with a current block comprising at least one colour block are received. A blending predictor is determined according to a weighted sum of at least two candidate predictions generated based on one or more first hypotheses of prediction, one or more second hypotheses of prediction, or both. The first hypotheses of prediction are generated based on one or more intra prediction modes comprising a DC mode, a planar mode or at least one angular modes. The second hypotheses of prediction are generated based on one or more cross-component modes and a collocated block of said at least one colour block. The input data associated with the colour block is encoded or decoded using the blending predictor.
    Type: Application
    Filed: December 20, 2022
    Publication date: February 20, 2025
    Inventors: Man-Shu CHIANG, Olena CHUBACH, Chia-Ming TSAI, Yu-Ling HSIAO, Chun-Chia CHEN, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250056008
    Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The system constructs two or more chroma prediction models based on luma and chroma samples neighboring the current block. The system applies the two or more chroma prediction models to incoming or reconstructed luma samples of the current block to produce two or more model predictions. The system computes predicted chroma samples by combining the two or more model predictions. The system uses the predicted chroma samples to reconstruct chroma samples of the current block or to encode the current block.
    Type: Application
    Filed: December 20, 2022
    Publication date: February 13, 2025
    Inventors: Yu-Ling HSIAO, Olena CHUBACH, Chun-Chia CHEN, Chia-Ming TSAI, Man-Shu CHIANG, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250046678
    Abstract: A method includes receiving a workpiece including a device layer disposed on a frontside of the workpiece, forming a frontside interconnect structure over the device layer, attaching a carrier substrate over the frontside interconnect structure, and etching from a backside of the workpiece to form first trenches and second trenches. The first trenches extend partially into the carrier substrate for a distance less than the second trenches. The method also includes forming a plurality of first conductive features in the first trenches and a plurality of second conductive features in the second trenches, forming a backside interconnect structure covering the first conductive features and the second conductive features, and thinning the carrier substrate from the frontside of the workpiece to expose the second conductive features. The first conductive features remain partially embedded in the carrier substrate.
    Type: Application
    Filed: January 8, 2024
    Publication date: February 6, 2025
    Inventors: Tsung-Chieh Hsiao, Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang
  • Publication number: 20250046667
    Abstract: A method includes forming a device die including forming integrated circuits on a semiconductor substrate; and forming a thermally conductive pillar extending into the semiconductor substrate. A cooling medium is attached over and contacting the semiconductor substrate to form a package, wherein the cooling medium is thermally coupled to the thermally conductive pillar.
    Type: Application
    Filed: October 6, 2023
    Publication date: February 6, 2025
    Inventors: Tsung-Chieh Hsiao, Ke-Gang Wen, Chih-Pin Chiu, Hsin-Feng Chen, Yu-Bey Wu, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20250046756
    Abstract: Interconnect structures for front-to-front stacked chips/dies and methods of fabrication thereof are disclosed herein. An exemplary system on integrated circuit (SoIC) includes a first die that is front-to-front bonded with a second die, for example, by bonding a first topmost metallization layer of a first frontside multilayer interconnect of the first die to a second topmost metallization layer of a second frontside multilayer interconnect of the second die. A through via extends partially through the first frontside multilayer interconnect of the first die, through a device layer of the first die, through a backside power rail of the first die, and through a carrier substrate. The backside power rail is between the carrier substrate and the device layer, and the backside power rail may be a portion of a backside multilayer interconnect of the first die. The through via may be connected to a redistribution layer (RDL) structure.
    Type: Application
    Filed: January 4, 2024
    Publication date: February 6, 2025
    Inventors: Tsung-Chieh Hsiao, Yi Ling Liu, Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang
  • Publication number: 20250039356
    Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video coding system derives multiple prediction linear models based on luma and chroma samples neighboring the current block. The video coding system constructs a composite linear model based on the multiple prediction linear models. The video coding system applies the composite linear model to incoming or reconstructed luma samples of the current block to generate a chroma predictor of the current block. The video coding system uses the chroma predictor to reconstruct chroma samples of the current block or to encode the current block.
    Type: Application
    Filed: December 29, 2022
    Publication date: January 30, 2025
    Inventors: Chia-Ming TSAI, Chun-Chia CHEN, Yu-Ling HSIAO, Man-Shu CHIANG, Chih-Wei HSU, Olena CHUBACH, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250038074
    Abstract: A method includes forming a first multilayer interconnect structure over a first side of a device layer, forming a first portion of a second multilayer interconnect structure under a second side of the device layer, forming a trench that extends through the second dielectric layer, the device layer, and the first dielectric layer, forming a conductive structure in the trench, and forming a second portion of the second multilayer interconnect structure under the first portion of the second multilayer interconnect structure. The second portion of the second multilayer interconnect structure includes patterned metal layers disposed in a third dielectric layer, and wherein one or more of the patterned metal layers are in electrical connection with the conductive structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: January 30, 2025
    Inventors: Tsung-Chieh Hsiao, Yi Ling Liu, Yun-Sheng Li, Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20250037751
    Abstract: A memory device includes a memory array comprising a plurality of word lines, the plurality of word lines operatively coupled to a plurality of sets of memory cells, respectively. The memory device includes a controller operatively coupled to the memory array, and comprising an adaptive tracking circuit. The adaptive tracking circuit is configured to: receive a first signal conducted through a first tracking line; receive an address signal indicating one of the word lines to be asserted; and adjust, based on the address signal, a timing of a transition edge of a second signal conducted through a second tracking line.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Cheng Chen, Yu Jie Hsiao, Ching-Wei Wu
  • Publication number: 20250024072
    Abstract: A method and apparatus for video coding system that uses intra prediction based on cross-colour linear model are disclosed. According to the method, model parameters for a first-colour predictor model are determined and the first-colour predictor model provides a predicted first-colour pixel value according to a combination of at least two corresponding reconstructed second-colour pixel values. According to another method, the first-colour predictor model provides a predicted first-colour pixel value based on a second degree model or higher of one or more corresponding reconstructed second-colour pixel values. First-colour predictors for the current first-colour block are determined according to the first-colour prediction model. The input data are then encoded at the encoder side or decoded at the decoder side using the first-colour predictors.
    Type: Application
    Filed: October 26, 2022
    Publication date: January 16, 2025
    Inventors: Olena CHUBACH, Ching-Yeh CHEN, Tzu-Der CHUANG, Chun-Chia CHEN, Man-Shu CHIANG, Chia-Ming TSAI, Yu-Ling HSIAO, Chih-Wei HSU, Yu-Wen HUANG
  • Patent number: 12152070
    Abstract: The present invention provides a PTX3 monoclonal antibody or antibody Fab fragment thereof and use thereof. The aforementioned monoclonal antibody or antibody Fab fragment thereof specifically inhibit or slow down the binding of PTX3 to the PTX3 receptor, and may be used for a kit and method for detecting PTX3, and a pharmaceutical composition which inhibits or slows down diseases or symptoms associated with PTX3 and PTX3 receptor binding, and a use thereof.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 26, 2024
    Assignee: Ohealth Biopharmaceutical (Suzhou) Co., Ltd.
    Inventors: Ju-Ming Wang, I-Chen Lee, Yu-Wei Hsiao, Jhih-Ying Chi, Jyun-yi Du, Hsin-Yin Liang, Chao-chun Cheng, Chiung-Yuan Ko, Feng-Wei Chen, Jhih-Yun Liu
  • Publication number: 20220119507
    Abstract: The present invention provides a PTX3 monoclonal antibody or antibody Fab fragment thereof and use thereof. The aforementioned monoclonal antibody or antibody Fab fragment thereof specifically inhibit or slow down the binding of PTX3 to the PTX3 receptor, and may be used for a kit and method for detecting PTX3, and a pharmaceutical composition which inhibits or slows down diseases or symptoms associated with PTX3 and PTX3 receptor binding, and a use thereof.
    Type: Application
    Filed: September 13, 2019
    Publication date: April 21, 2022
    Inventors: Ju-Ming Wang, I-Chen Lee, Yu-Wei Hsiao, Jhih-Ying Chi, Jyun-yi Du, Hsin-Yin Liang, Chao-chun Cheng, Chiung-Yuan Ko, Feng-Wei Chen, Jhih-Yun Liu
  • Patent number: 10421797
    Abstract: The present invention relates to a short peptide-based therapeutic agent and a medicinal composition including the same for inhibiting activities of cancer cells, which includes at least one short peptide listed as SEQ ID NOs: 1 and 2, either of which is unglycosylated and has no more than 40 amino acid residues, thereby specifically reducing or inhibiting activities of cancer cells such as the cancer cell proliferation, cancer stemness, cell migration, cancer cell invasion, metastasis or drug resistance.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: September 24, 2019
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Ju-Ming Wang, Yu-Wei Hsiao, Jhih-Ying Chi
  • Publication number: 20180002400
    Abstract: The present invention relates to a short peptide-based therapeutic agent and a medicinal composition including the same for inhibiting activities of cancer cells, which includes at least one short peptide listed as SEQ ID NOs: 1 and 2, either of which is unglycosylated and has no more than 40 amino acid residues, thereby specifically reducing or inhibiting activities of cancer cells such as the cancer cell proliferation, cancer stemness, cell migration, cancer cell invasion, metastasis or drug resistance.
    Type: Application
    Filed: September 6, 2017
    Publication date: January 4, 2018
    Inventors: Ju-Ming WANG, Yu-Wei HSIAO, Jhih-Ying CHI
  • Patent number: 9802998
    Abstract: The present invention relates to a short peptide-based therapeutic agent and a medicinal composition including the same for inhibiting activities of cancer cells, which includes at least one short peptide listed as SEQ ID NOs: 1 and 2, either of which is unglycosylated and has no more than 40 amino acid residues, thereby specifically reducing or inhibiting activities of cancer cells such as the cancer cell proliferation, cancer stemness, cell migration, cancer cell invasion, metastasis or drug resistance.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: October 31, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Ju-Ming Wang, Yu-Wei Hsiao, Jhih-Ying Chi