Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.

Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.

Abstract: A method of forming an integrated circuit, including forming a n-type doped well (N-well) and a p-type doped well (P-well) disposed side by side on a semiconductor substrate, forming a first fin active region extruded from the N-well and a second fin active region extruded from the P-well, forming a first isolation feature inserted between and vertically extending through the N-well and the P-well, and forming a second isolation feature over the N-well and the P-well and laterally contacting the first and the second fin active regions.

Abstract: A memory device includes a substrate, a first transistor and a second transistor, a first word line, a second word line, and a bit line. The first transistor and the second transistor are over the substrate and are electrically connected to each other, in which each of the first and second transistors includes first semiconductor layers and second semiconductor layers, a gate structure, and source/drain structures, in which the first semiconductor layers are in contact with the second semiconductor layers, and a width of the first semiconductor layers is narrower than a width of the second semiconductor layers. The first word line is electrically connected to the gate structure of the first transistor. The second word line is electrically connected to the gate structure of the second transistor. The bit line is electrically connected to a first one of the source/drain structures of the first transistor.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: Fire-retardant panels that include: a frame with multiple holes that reduce heat conduction through the panel; or a frame that includes two portions separated by a layer of fire-resistant material (e.g., gypsum, calcium silicate, or gypsum board). Some embodiments include skins (e.g., sheet metal) or insulation (e.g., between skin and fire-resistant material, for instance, within the frame). In particular embodiments, the fire-resistant material is (e.g., midway) between: two skins, two layers of insulation, two portions of the frame, or a combination thereof. The portions of the frame can be: sheet metal, attached (e.g., screwed) to the skin(s) or to each other, or extend around the perimeter. The frame can include: various elongated members, (e.g., parallel) bends, or holes that are: in at least one row, elongated, or slots (e.g., parallel to each other or to the skin).

Abstract: Fire-retardant panels that include: a frame with multiple holes that reduce heat conduction through the panel; or a frame that includes two portions separated by a layer of fire-resistant material (e.g., gypsum, calcium silicate, or gypsum board). Some embodiments include skins (e.g., sheet metal) or insulation (e.g., between skin and fire-resistant material, for instance, within the frame). In particular embodiments, the fire-resistant material is (e.g., midway) between: two skins, two layers of insulation, two portions of the frame, or a combination thereof. The portions of the frame can be: sheet metal, attached (e.g., screwed) to the skin(s) or to each other, or extend around the perimeter. The frame can include: various elongated members, (e.g., parallel) bends, or holes that are: in at least one row, elongated, or slots (e.g., parallel to each other or to the skin).

Abstract: Fire-retardant panels that include: a frame with multiple holes in at least two rows that reduce heat conduction through the panel; or a frame that includes two portions separated by a layer of fire-resistant material (e.g., gypsum, calcium silicate, or gypsum board). Some embodiments include layers of skin (e.g., sheet metal) or insulation (e.g., between skin and fire-resistant material). In particular embodiments, the fire-resistant material is (e.g., midway) between: two skins, two layers of insulation, two portions of the frame, or a combination thereof. The portions of the frame can be: sheet metal, attached (e.g., screwed) to the skin(s), or extend around the perimeter. The frame can include: various elongated members, one or two (e.g., parallel) bends, or holes that are: in at least three rows, staggered, elongated, or slots (e.g., parallel to each other or to the skin).

Abstract: Fire-retardant panels that include: two skins (e.g., sheet metal) and a layer of gypsum or calcium silicate fire-resistant material therebetween; two layers of insulation with fire-resistant material therebetween; a skin (e.g., sheet metal), a layer of gypsum or calcium silicate fire-resistant material, and insulation therebetween; or a combination thereof. Some embodiments include: two contiguous layers of the fire-resistant material, gypsum board, tongue and groove connections; or a frame that extends around the perimeter or has two portions that are attached to the skins or are separated by the fire-resistant material. In some embodiments, the fire-retardant panel is fabricated in a factory before being installed at a jobsite.

Abstract: Fire-retardant panels that include: a frame with multiple holes in at least two rows that reduce heat conduction through the panel; or a frame that includes two portions separated by a layer of fire-resistant material (e.g., gypsum, calcium silicate, or gypsum board). Some embodiments include layers of skin (e.g., sheet metal) or insulation (e.g., between skin and fire-resistant material). In particular embodiments, the fire-resistant material is (e.g., midway) between: two skins, two layers of insulation, two portions of the frame, or a combination thereof. The portions of the frame can be: sheet metal, attached (e.g., screwed) to the skin(s), or extend around the perimeter. The frame can include: various elongated members, one or two (e.g., parallel) bends, or holes that are: in at least three rows, staggered, elongated, or slots (e.g., parallel to each other or to the skin).

Abstract: A control system and a method for initializing the control system are provided. The control system includes a control platform and a plurality of target modules SM1˜SMn. Data transmission ends of the target modules are connected to the control platform. A power input end of the target module SM1 receives an operation electrical energy. The target module SM1 delays the operation electrical energy by a first period, and outputs the operation electrical energy via a power output end of the target modules SM1. A power input end of the target module SMi receives the operation electrical energy from a power output end of the target module SM(i-1). The target module SMi delays the operation electrical energy by an nth period, and outputs the operation electrical energy via a power output end of the target modules SMi, wherein 1?i?n.

Abstract: The disclosed exemplary embodiments relates to a control system and a control method for identifying corresponding position. The control system includes a plurality of electronic control modules, each electronic control module having a microcontroller electrically coupled to at least one joint, and the joint is configured for connecting to a joint of neighboring electronic control module. The electronic control modules include a main-control-terminal electronic control module, an assembling electronic control module and at least one detecting electronic control module. The main-control-terminal electronic control module is configured for assigning one of the electronic control modules to be the assembling electronic control module, and assigning the rest of the electronic control modules to be the detecting electronic control module.

Abstract: An electrode patch module, a chronic pain detection method and an apparatus thereof are provided. The electrode patch module affixed at a zone to be tested contains at least three electrode pads. The chronic pain detection apparatus selects multiple electrode pairs from the electrode pads and uses the electrode pairs to measure the zone to be tested so as to obtain multiple characteristic values of different muscle areas. The chronic pain detection apparatus receives the characteristic values for performing comparison operations to produce a result for assistant judging where the chronic pain may have in the zone to be tested.

Abstract: A wheelchair includes a seat, one or more wheels and a seat weight sensing mechanism. The wheel includes a brake for stopping the wheel. The seat weight sensing mechanism is placed below the seat and is connected to the brake. When the seat is loaded by a weight more than a predetermined value, the seat weight sensing mechanism releases the brake to free the wheel. When the seat is not loaded by a weight more than a predetermined value, the brake stops the wheel.

Abstract: The disclosed exemplary embodiments relates to a control system and a control method for identifying corresponding position. The control system includes a plurality of electronic control modules, each electronic control module having a microcontroller electrically coupled to at least one joint, and the joint is configured for connecting to a joint of neighboring electronic control module. The electronic control modules include a main-control-terminal electronic control module, an assembling electronic control module and at least one detecting electronic control module. The main-control-terminal electronic control module is configured for assigning one of the electronic control modules to be the assembling electronic control module, and assigning the rest of the electronic control modules to be the detecting electronic control module.

Abstract: A wheelchair includes a seat, one or more wheels and a seat weight sensing mechanism. The wheel includes a brake for stopping the wheel. The seat weight sensing mechanism is placed below the seat and is connected to the brake. When the seat is loaded by a weight more than a predetermined value, the seat weight sensing mechanism releases the brake to free the wheel. When the seat is not loaded by a weight more than a predetermined value, the brake stops the wheel.

Abstract: A control system and a method for initializing the control system are provided. The control system includes a control platform and a plurality of target modules SM1˜SMn. Data transmission ends of the target modules are connected to the control platform. A power input end of the target module SM1 receives an operation electrical energy. The target module SM1 delays the operation electrical energy by a first period, and outputs the operation electrical energy via a power output end of the target modules SM1. A power input end of the target module SMi receives the operation electrical energy from a power output end of the target module SM(i?1). The target module SMi delays the operation electrical energy by an nth period, and outputs the operation electrical energy via a power output end of the target modules SMi, wherein 1?i?n.